Stiftleisten, Buchsen, Buchsen

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

Alles zurücksetzen
Alle anwenden
Ergebnis
Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESQ-111-33-T-S

ESQ-111-33-T-S

CONN SOCKET 11POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-111-33-T-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
153224-2000-RB-WD

153224-2000-RB-WD

CONN RCPT 24POS 0.079 GOLD SMD

3M

39 -
RFQ
153224-2000-RB-WD

Datenblatt

1532 Tape & Reel (TR) Active Receptacle, Bottom or Top Entry Female Socket Board to Board or Cable 24 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.129" (3.28mm) - -55°C ~ 105°C UL94 V-0 Tin - - Pick and Place 1A 500VDC
SQT-108-01-LM-S

SQT-108-01-LM-S

CONN RCPT 8POS 0.079 GOLD PCB

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 8 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESQ-105-69-L-S

ESQ-105-69-L-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-69-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-112-14-T-S

ESW-112-14-T-S

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-112-14-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-103-23-S-D

ESQ-103-23-S-D

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-103-23-S-D

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-113-12-T-S

ESQ-113-12-T-S

CONN SOCKET 13POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-113-12-T-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SSW-125-02-T-D-RA-LL

SSW-125-02-T-D-RA-LL

CONN RCPT 50POS 0.1 TIN PCB R/A

Samtec Inc.

0 -
RFQ
SSW-125-02-T-D-RA-LL

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 50 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole, Right Angle Kinked Pin, Solder Push-Pull Tin - Black 0.195" (4.95mm) 0.100" (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
ESW-105-39-S-S

ESW-105-39-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-39-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
87606-338LF

87606-338LF

CONN RCPT 76POS 0.1 GOLD PCB

Amphenol ICC (FCI)

0 -
RFQ
87606-338LF

Datenblatt

Dubox™ Tube Active Receptacle Female Socket Board to Board 76 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Blue 0.335" (8.51mm) 0.114" (2.90mm) - UL94 V-0 Tin - - - - -
ESW-106-24-S-S

ESW-106-24-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-24-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-108-33-L-S

ESW-108-33-L-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-108-33-L-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-111-34-T-S

ESW-111-34-T-S

CONN SOCKET 11POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-111-34-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-103-23-G-D-LL

ESQ-103-23-G-D-LL

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-103-23-G-D-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
SQT-114-01-F-D-009

SQT-114-01-F-D-009

CONN RCPT 28POS 0.079 GOLD PCB

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 28 27 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESW-105-34-S-S

ESW-105-34-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-34-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-107-58-S-D

ESW-107-58-S-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-107-58-S-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-34-G-S

ESW-106-34-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-34-G-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESQ-107-24-L-S

ESQ-107-24-L-S

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-107-24-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-110-33-G-S-LL

ESQ-110-33-G-S-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-110-33-G-S-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
Total 142211 Record«Prev1... 12051206120712081209121012111212...7111Next»
TomatoElec

Suche

TomatoElec

Produkte

TomatoElec

Telefon

TomatoElec

Benutzer