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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESW-104-69-S-D

ESW-104-69-S-D

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-104-69-S-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-104-38-G-D

ESQ-104-38-G-D

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-104-38-G-D

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESW-106-34-T-D

ESW-106-34-T-D

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-106-34-T-D

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
SQT-109-01-L-D-RA-008

SQT-109-01-L-D-RA-008

CONN RCPT 18P 0.079 GOLD PCB R/A

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 18 17 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.157" (4.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
SQT-109-01-L-D-RA-009

SQT-109-01-L-D-RA-009

CONN RCPT 18P 0.079 GOLD PCB R/A

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 18 17 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.157" (4.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
89883-330LF

89883-330LF

CONN RCPT 60POS 0.1 GOLD PCB R/A

Amphenol ICC (FCI)

0 -
RFQ
89883-330LF

Datenblatt

Dubox™ Tube Active Receptacle Female Socket Board to Board 60 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole, Right Angle Solder Push-Pull Gold 30.0µin (0.76µm) Blue 0.230" (5.85mm) 0.114" (2.90mm) - UL94 V-0 Tin - - - - -
SQT-113-01-F-D-001

SQT-113-01-F-D-001

CONN RCPT 26POS 0.079 GOLD PCB

Samtec Inc.

0 -
RFQ

-

SQT Bulk Active Receptacle Forked Board to Board or Cable 26 25 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
SQT-113-01-F-D-003

SQT-113-01-F-D-003

CONN RCPT 26POS 0.079 GOLD PCB

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 26 25 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold Flash Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
RSM-108-02-T-S-P

RSM-108-02-T-S-P

CONN RCPT 8POS 0.05 TIN SMD

Samtec Inc.

0 -
RFQ
RSM-108-02-T-S-P

Datenblatt

RSM Tube Active Receptacle Female Socket Board to Board 8 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - Pick and Place 3.1A per Contact -
ESW-108-37-L-S

ESW-108-37-L-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-108-37-L-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-107-23-S-D-11

ESW-107-23-S-D-11

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-107-23-S-D-11

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 14 13 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
SSW-140-02-T-S-RA-LL

SSW-140-02-T-S-RA-LL

CONN RCPT 40POS 0.1 TIN PCB R/A

Samtec Inc.

0 -
RFQ

-

SSW Bulk Active Receptacle Forked Board to Board or Cable 40 All 0.100" (2.54mm) 1 - Through Hole, Right Angle Kinked Pin, Solder Push-Pull Tin - Black 0.095" (2.41mm) 0.100" (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
ESQ-102-34-G-D-LL

ESQ-102-34-G-D-LL

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-102-34-G-D-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESQ-106-44-L-S

ESQ-106-44-L-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-44-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-107-13-G-S-007

ESQ-107-13-G-S-007

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-107-13-G-S-007

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 7 6 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESW-105-14-G-S-LL

ESW-105-14-G-S-LL

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-14-G-S-LL

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-112-23-T-S

ESW-112-23-T-S

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-112-23-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-111-23-T-S

ESQ-111-23-T-S

CONN SOCKET 11POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-111-23-T-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
09195266829

09195266829

SEK/IDC LOW PROFILE STRAIGHT FEM

HARTING

90 -
RFQ
09195266829

Datenblatt

SEK Bulk Active Receptacle Female Socket Board to Board or Cable 26 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Press-Fit Push-Pull Gold - Black 0.455" (11.56mm) 0.177" (4.50mm) -55°C ~ 125°C UL94 V-0 Nickel - - - 1A -
09195306824

09195306824

SEK/IDC THR/SMC LOW PROFILE STRA

HARTING

85 -
RFQ
09195306824

Datenblatt

SEK Bulk Active Receptacle Female Socket Board to Board or Cable 30 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold - Black 0.455" (11.56mm) 0.114" (2.90mm) -55°C ~ 125°C UL94 V-0 Tin - - - 1A -
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