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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESW-107-24-T-D

ESW-107-24-T-D

CONN SOCKET 14POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-107-24-T-D

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-109-12-L-S

ESQ-109-12-L-S

CONN SOCKET 9POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-109-12-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SQT-110-01-F-D-RA-005

SQT-110-01-F-D-RA-005

CONN RCPT 20P 0.079 GOLD PCB R/A

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 20 19 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold Flash Black 0.157" (4.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESQ-103-38-G-D-LL

ESQ-103-38-G-D-LL

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-103-38-G-D-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESQ-108-37-L-S

ESQ-108-37-L-S

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-108-37-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
RSM-106-02-L-S-P

RSM-106-02-L-S-P

CONN RCPT 6POS 0.05 GOLD SMD

Samtec Inc.

0 -
RFQ
RSM-106-02-L-S-P

Datenblatt

RSM Tube Active Receptacle Female Socket Board to Board 6 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - Pick and Place 3.1A per Contact -
ESW-106-39-S-S

ESW-106-39-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-39-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-111-44-T-S

ESW-111-44-T-S

CONN SOCKET 11POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-111-44-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 11 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-114-13-T-S

ESW-114-13-T-S

CONN SOCKET 14POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-114-13-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
TLE-104-01-G-DV-TR

TLE-104-01-G-DV-TR

CONN RCPT 8POS 0.079 GOLD SMD

Samtec Inc.

0 -
RFQ

-

TLE Tape & Reel (TR) Active Receptacle, Pass Through Female Socket Board to Board or Cable 8 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - Gold - - - 3.2A per Contact -
ESQ-105-39-G-S

ESQ-105-39-G-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-39-G-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.480" (12.19mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESW-105-49-S-S

ESW-105-49-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-49-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-105-24-S-S

ESQ-105-24-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-24-S-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-113-12-T-S-LL

ESQ-113-12-T-S-LL

CONN SOCKET 13POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-113-12-T-S-LL

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 13 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-106-49-G-S

ESW-106-49-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-49-G-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-106-34-S-S

ESW-106-34-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-34-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-107-34-L-S

ESQ-107-34-L-S

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-107-34-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-115-12-T-S

ESW-115-12-T-S

CONN SOCKET 15POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-115-12-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 15 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-105-44-S-S

ESW-105-44-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-44-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-106-24-G-S

ESQ-106-24-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-24-G-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
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