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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
518-77-520M31-001106

518-77-520M31-001106

CONN SOCKET PGA 520POS GOLD

Preci-Dip

0 -
RFQ
518-77-520M31-001106

Datenblatt

518 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
105-PLS17055-12

105-PLS17055-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
105-PLS17055-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
105-PRS17054-12

105-PRS17054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
105-PRS17054-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
550-10-600M35-001152

550-10-600M35-001152

BGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-600M35-001152

Datenblatt

550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
191-PGM18015-10T

191-PGM18015-10T

CONN SOCKET PGA TIN

Aries Electronics

0 -
RFQ
191-PGM18015-10T

Datenblatt

PGM Bulk Active PGA - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
64-PLS16016-12

64-PLS16016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
64-PLS16016-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
101-PRS14030-12

101-PRS14030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
101-PRS14030-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
558-10-576M30-001101

558-10-576M30-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
RFQ
558-10-576M30-001101

Datenblatt

558 Bulk Active PGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
514-83-652M35-001148

514-83-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

0 -
RFQ
514-83-652M35-001148

Datenblatt

514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-3551-18

28-3551-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
234-3034-02-0602

234-3034-02-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

0 -
RFQ
234-3034-02-0602

Datenblatt

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (2 x 17) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
24-6574-18

24-6574-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
RFQ
24-6574-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-560M33-001104

558-10-560M33-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-560M33-001104

Datenblatt

558 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-560M33-001105

518-77-560M33-001105

CONN SOCKET PGA 560POS GOLD

Preci-Dip

0 -
RFQ
518-77-560M33-001105

Datenblatt

518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-600M35-001101

558-10-600M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
RFQ
558-10-600M35-001101

Datenblatt

558 Bulk Active PGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
168-PLS17011-12

168-PLS17011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
168-PLS17011-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
172-PLS16002-12

172-PLS16002-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
172-PLS16002-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
24-6570-18

24-6570-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ
24-6570-18

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
7010402515

7010402515

TEXTOOL1017-2-0252-0B-00L20 PP15

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
518-77-560M33-001106

518-77-560M33-001106

CONN SOCKET PGA 560POS GOLD

Preci-Dip

0 -
RFQ
518-77-560M33-001106

Datenblatt

518 Bulk Active PGA 560 (33 x 33) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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