IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
441-PGG21001-40

441-PGG21001-40

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
441-PGG21001-40

Datenblatt

PGG Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
85-PRS11008-12

85-PRS11008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
85-PRS11008-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
2196-9026-01-2401

2196-9026-01-2401

TEXTOOL 2196-9026-01-2401 BGA OP

3M

0 -
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
169-PLS13001-12

169-PLS13001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
169-PLS13001-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
225-PGM15001-51

225-PGM15001-51

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
225-PGM15001-51

Datenblatt

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
96-PRS14024-12

96-PRS14024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
96-PRS14024-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
518-77-478M26-131106

518-77-478M26-131106

CONN SOCKET PGA 478POS GOLD

Preci-Dip

0 -
RFQ
518-77-478M26-131106

Datenblatt

518 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-520M31-001101

558-10-520M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
RFQ
558-10-520M31-001101

Datenblatt

558 Bulk Active PGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
84-536-11

84-536-11

CONN SOCKET PLCC ZIF 84POS GOLD

Aries Electronics

0 -
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
518-77-480M29-001106

518-77-480M29-001106

CONN SOCKET PGA 480POS GOLD

Preci-Dip

0 -
RFQ
518-77-480M29-001106

Datenblatt

518 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
56-PLS14031-12

56-PLS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
56-PLS14031-12

Datenblatt

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
56-PRS14031-12

56-PRS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
56-PRS14031-12

Datenblatt

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
44-6552-16

44-6552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-6552-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3554-16

44-3554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-3554-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6553-16

44-6553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-6553-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3551-16

44-3551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-3551-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3552-16

44-3552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-3552-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3553-16

44-3553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-3553-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6551-16

44-6551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-6551-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6554-16

44-6554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0 -
RFQ
44-6554-16

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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