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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
116-87-322-41-006101

116-87-322-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
116-87-322-41-006101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2-640361-2

2-640361-2

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-640361-2

Datenblatt

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
HLS-0104-T-15

HLS-0104-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0104-T-15

Datenblatt

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
SMPX-68LCC-N

SMPX-68LCC-N

SMT PLCC SOCKET 68P NON POLARISE

Kycon, Inc.

0 -
RFQ
SMPX-68LCC-N

Datenblatt

SMPX Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
614-87-324-41-001101

614-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
614-87-324-41-001101

Datenblatt

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 24-HZL/07-TT

AR 24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
RFQ
AR 24-HZL/07-TT

Datenblatt

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
D01-9951042

D01-9951042

CONN SOCKET SIP 10POS GOLD

Harwin Inc.

0 -
RFQ
D01-9951042

Datenblatt

D01-995 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-628-41-134161

114-87-628-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
114-87-628-41-134161

Datenblatt

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-006101

116-87-320-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-87-320-41-006101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-312-41-007101

116-83-312-41-007101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
116-83-312-41-007101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X22-157B

SIP050-1X22-157B

1X22-157B-SIP SOCKET 22 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X22-157B

Datenblatt

SIP050-1x Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
A40-LCG-T-R

A40-LCG-T-R

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
RFQ
A40-LCG-T-R

Datenblatt

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
05-0513-11H

05-0513-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
RFQ
05-0513-11H

Datenblatt

0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0513-11

06-0513-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0513-11

Datenblatt

0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
07-0513-10H

07-0513-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
RFQ
07-0513-10H

Datenblatt

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
114-83-320-41-117101

114-83-320-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
114-83-320-41-117101

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
9-1437535-4

9-1437535-4

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
9-1437535-4

Datenblatt

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper - -55°C ~ 125°C
116-87-314-41-009101

116-87-314-41-009101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-87-314-41-009101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-003101

116-87-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-87-320-41-003101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZSTT

ICO-308-ZSTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-308-ZSTT

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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