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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
146-87-314-41-035101

146-87-314-41-035101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
146-87-314-41-035101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-314-41-036101

146-87-314-41-036101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
146-87-314-41-036101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X21-157B

SIP050-1X21-157B

1X21-157B-SIP SOCKET 21 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X21-157B

Datenblatt

SIP050-1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
410-87-228-10-001101

410-87-228-10-001101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

0 -
RFQ
410-87-228-10-001101

Datenblatt

410 Bulk Active Zig-Zag, Left Stackable 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-87-228-10-002101

410-87-228-10-002101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

0 -
RFQ
410-87-228-10-002101

Datenblatt

410 Bulk Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-008101

116-87-314-41-008101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-87-314-41-008101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X27-001B

SIP1X27-001B

SIP1X27-001B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X27-001B

Datenblatt

SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
AR64-HZL-TT

AR64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

0 -
RFQ
AR64-HZL-TT

Datenblatt

- Bag Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
917-83-108-41-053101

917-83-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

0 -
RFQ
917-83-108-41-053101

Datenblatt

917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-3518-10M

08-3518-10M

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-3518-10M

Datenblatt

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-2513-11

06-2513-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-2513-11

Datenblatt

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-1518-10T

16-1518-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
RFQ
16-1518-10T

Datenblatt

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-87-322-41-001101

612-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
612-87-322-41-001101

Datenblatt

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X18-160B

SIP050-1X18-160B

1X18-160B-SIP SOCKET 18 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X18-160B

Datenblatt

SIP050-1x Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
400-028-000

400-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

0 -
RFQ

-

400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
917-87-210-41-053101

917-87-210-41-053101

CONN TRANSIST TO-5 10POS GOLD

Preci-Dip

0 -
RFQ
917-87-210-41-053101

Datenblatt

917 Bulk Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-316-41-105191

110-87-316-41-105191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ

-

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-610-41-009101

116-83-610-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-610-41-009101

Datenblatt

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-3513-11

08-3513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-3513-11

Datenblatt

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-308-41-011101

116-83-308-41-011101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-011101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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