IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
540-88-028-17-400-TR

540-88-028-17-400-TR

CONN SOCKET PLCC 28POS TIN

Preci-Dip

0 -
RFQ
540-88-028-17-400-TR

Datenblatt

540 Tape & Reel (TR) Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
116-87-308-41-002101

116-87-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-002101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1814642-1

1814642-1

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1814642-1

Datenblatt

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
110-87-314-41-105101

110-87-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-87-314-41-105101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-ICS-254-06-TT50

A-ICS-254-06-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
RFQ
A-ICS-254-06-TT50

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-87-610-41-012101

116-87-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-610-41-012101

Datenblatt

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-312-31-012101

614-87-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
614-87-312-31-012101

Datenblatt

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP624-001B

DIP624-001B

DIP624-001B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP624-001B

Datenblatt

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
06-3518-00

06-3518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-3518-00

Datenblatt

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A-CCS 020-Z-SM/T

A-CCS 020-Z-SM/T

IC SOCKET, CHIP CARRIER, 1.27MM,

Assmann WSW Components

0 -
RFQ
A-CCS 020-Z-SM/T

Datenblatt

- Tape & Reel (TR) Active PLCC 20 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
110-83-314-41-001101

110-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-83-314-41-001101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X10-041B

SIP1X10-041B

SIP1X10-041B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X10-041B

Datenblatt

SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-83-308-41-003101

116-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-003101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A24-LCG-T-R

A24-LCG-T-R

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
RFQ
A24-LCG-T-R

Datenblatt

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
116-87-304-41-013101

116-87-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
116-87-304-41-013101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR16-HZW/T

AR16-HZW/T

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
RFQ
AR16-HZW/T

Datenblatt

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
110-83-312-01-680101

110-83-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
110-83-312-01-680101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-312-41-117101

114-83-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
114-83-312-41-117101

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-312-41-134161

114-83-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
114-83-312-41-134161

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP632-014B

DIP632-014B

DIP632-014B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP632-014B

Datenblatt

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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