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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
AR 20-HZL/01-TT

AR 20-HZL/01-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
146-83-306-41-035101

146-83-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
146-83-306-41-035101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-306-41-036101

146-83-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
146-83-306-41-036101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1052000001

1052000001

SMIA55 CAMERA SOCKET BOTTOM CONT

Molex

0 -
RFQ
1052000001

Datenblatt

105200 Tray Obsolete Camera Socket 12 (2 x 6) 0.028" (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028" (0.70mm) Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
410-87-216-10-001101

410-87-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0 -
RFQ
410-87-216-10-001101

Datenblatt

410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-87-216-10-002101

410-87-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

0 -
RFQ
410-87-216-10-002101

Datenblatt

410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-018101

116-83-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-018101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-210-41-117101

114-83-210-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
114-83-210-41-117101

Datenblatt

114 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-01-822101

110-83-316-01-822101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
110-83-316-01-822101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-308-41-001101

122-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
122-87-308-41-001101

Datenblatt

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-006101

116-87-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
116-87-312-41-006101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-025-05-000101

510-87-025-05-000101

CONN SOCKET PGA 25POS GOLD

Preci-Dip

0 -
RFQ
510-87-025-05-000101

Datenblatt

510 Bulk Active PGA 25 (5 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-316-41-117101

114-87-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
114-87-316-41-117101

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS068-Z-SM/P

A-CCS068-Z-SM/P

SOCKET

Assmann WSW Components

0 -
RFQ

-

- Bulk Active PLCC 68 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
146-87-308-41-035101

146-87-308-41-035101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
146-87-308-41-035101

Datenblatt

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-308-41-036101

146-87-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
146-87-308-41-036101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-008101

116-87-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-008101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-020-24-000000

540-99-020-24-000000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
540-99-020-24-000000

Datenblatt

540 Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
SIP050-1X12-157B

SIP050-1X12-157B

1X12-157B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X12-157B

Datenblatt

SIP050-1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AW127-20/Z-T-R

AW127-20/Z-T-R

SOCKET 20 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW127-20/Z-T-R

Datenblatt

- Bulk Obsolete - 20 (1 x 20) 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Brass Through Hole - Solder 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
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