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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESW-105-33-T-D

ESW-105-33-T-D

CONN SOCKET 10POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-105-33-T-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-105-23-T-S

ESQ-105-23-T-S

CONN SOCKET 5POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-105-23-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-104-12-S-S-LL

ESW-104-12-S-S-LL

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-104-12-S-S-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-105-23-T-D-LL

ESW-105-23-T-D-LL

CONN SOCKET 10POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-105-23-T-D-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-104-24-T-D

ESW-104-24-T-D

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-104-24-T-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-58-L-S

ESW-106-58-L-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-58-L-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-107-33-T-S-LL

ESQ-107-33-T-S-LL

CONN SOCKET 7POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-107-33-T-S-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-104-13-L-S

ESQ-104-13-L-S

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-104-13-L-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-106-13-G-S

ESW-106-13-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-13-G-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-106-33-T-D

ESW-106-33-T-D

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-106-33-T-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-105-33-T-S

ESQ-105-33-T-S

CONN SOCKET 5POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-105-33-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-106-23-T-S

ESQ-106-23-T-S

CONN SOCKET 6POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-106-23-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-105-13-L-S

ESQ-105-13-L-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-13-L-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-103-44-G-S-LL

ESW-103-44-G-S-LL

CONN SOCKET 3POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-103-44-G-S-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 3 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-104-23-T-D-06

ESW-104-23-T-D-06

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-104-23-T-D-06

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 8 7 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-23-T-D-LL

ESW-106-23-T-D-LL

CONN SOCKET 12POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-106-23-T-D-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
DF11Z-24DS-2V(50)

DF11Z-24DS-2V(50)

CONN RCPT 24POS 0.079 GOLD SMD

Hirose Electric Co Ltd

41 -
RFQ
DF11Z-24DS-2V(50)

Datenblatt

DF11 Tube Obsolete Receptacle Female Socket Board to Board or Cable 24 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Friction Lock Gold 8.00µin (0.203µm) Beige 0.234" (5.95mm) - -30°C ~ 85°C UL94 V-0 Tin 7.55mm, 8.2mm - Board Guide, Solder Retention 2A 250V
5054061460

5054061460

CONN RCPT 14POS 0.059 GOLD SMD

Molex

41 -
RFQ
5054061460

Datenblatt

CLIK-Mate 505406 Tape & Reel (TR) Obsolete Receptacle Forked Board to Cable/Wire 14 All 0.059" (1.50mm) 2 - Surface Mount Solder Latch Holder Gold 8.00µin (0.203µm) Beige 0.344" (8.75mm) - -40°C ~ 105°C UL94 V-0 Tin - - Solder Retention - -
ESW-106-13-S-S

ESW-106-13-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-13-S-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-101-24-G-S

ESQ-101-24-G-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-101-24-G-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
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