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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESW-104-12-T-S-LL

ESW-104-12-T-S-LL

CONN SOCKET 4POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-104-12-T-S-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-13-T-S

ESW-106-13-T-S

CONN SOCKET 6POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-106-13-T-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-104-33-T-S

ESW-104-33-T-S

CONN SOCKET 4POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-104-33-T-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
MPF-A-06-SMT-T-KT-T/R

MPF-A-06-SMT-T-KT-T/R

MINI FLEX FEMALE 6P SMD

Adam Tech

550 -
RFQ
MPF-A-06-SMT-T-KT-T/R

Datenblatt

MPF Tape & Reel (TR) Active Socket Forked Board to Board or Cable 6 All 0.050" (1.27mm) 2 0.059" (1.50mm) Surface Mount Solder Push-Pull Tin - Red 0.138" (3.50mm) - -40°C ~ 105°C UL94 V-0 Tin - - Pick and Place 1A 250VAC
ESQ-102-12-T-S

ESQ-102-12-T-S

CONN SOCKET 2POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-102-12-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SSQ-106-03-T-S

SSQ-106-03-T-S

CONN RCPT 6POS 0.1 TIN PCB

Samtec Inc.

88 -
RFQ
SSQ-106-03-T-S

Datenblatt

SSQ Bulk Active Receptacle Forked Board to Board or Cable 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.394" (10.00mm) -55°C ~ 105°C UL94 V-0 Tin - - - - 465VAC, 655VDC
BSW-102-04-L-S

BSW-102-04-L-S

CONN RCPT 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
BSW-102-04-L-S

Datenblatt

BSW Bulk Active Receptacle, Breakaway Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole, Bottom Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.350" (8.89mm) 0.170" (4.32mm) -55°C ~ 125°C UL94 V-0 Tin - - - - -
ESW-104-23-T-S-LL

ESW-104-23-T-S-LL

CONN SOCKET 4POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-104-23-T-S-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-101-58-G-S

ESW-101-58-G-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-101-58-G-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-102-58-L-S

ESW-102-58-L-S

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-102-58-L-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-101-34-G-S

ESW-101-34-G-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-101-34-G-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
315-47-109-41-001000

315-47-109-41-001000

CONN RCPT 9POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

69 -
RFQ
315-47-109-41-001000

Datenblatt

315 Tube Active Receptacle Female Socket Board to Board 9 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.110" (2.79mm) 0.108" (2.75mm) -55°C ~ 125°C UL94 V-0 Tin - - - 3A 100V, 150VDC
316-93-103-41-008000

316-93-103-41-008000

CONN SOCKET 3POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

95 -
RFQ
316-93-103-41-008000

Datenblatt

316 Tube Active Elevated Socket Female Socket Board to Board 3 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.472" (12.00mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - - - 3A -
ESW-107-13-T-S

ESW-107-13-T-S

CONN SOCKET 7POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-107-13-T-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-102-23-G-S

ESW-102-23-G-S

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-102-23-G-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESQ-102-23-T-S

ESQ-102-23-T-S

CONN SOCKET 2POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-102-23-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-106-23-T-S-LL

ESW-106-23-T-S-LL

CONN SOCKET 6POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-106-23-T-S-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Kinked Pin, Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
5-147730-1

5-147730-1

CONN RCPT 3POS 0.1 GOLD SMD

TE Connectivity AMP Connectors

0 -
RFQ
5-147730-1

Datenblatt

AMPMODU Mod IV Tape & Reel (TR) Obsolete Receptacle, Bottom or Top Entry Female Socket Board to Board or Cable 3 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.265" (6.73mm) - -65°C ~ 125°C UL94 V-0 Tin - - Board Lock, Pick and Place 2A -
ESQ-102-33-T-S

ESQ-102-33-T-S

CONN SOCKET 2POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-102-33-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-102-33-G-S

ESW-102-33-G-S

CONN SOCKET 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-102-33-G-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
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