Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
SL LP 6 SMD 066 26 S

SL LP 6 SMD 066 26 S

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 26 S

Datenblatt

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 26 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 360 8 Z

SL 6 360 8 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 360 8 Z

Datenblatt

SL 6 360 - Active Header Male Pin 0.100" (2.54mm) 8 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.783" (45.30mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL LP 6 SMD 066 20 S SM

SL LP 6 SMD 066 20 S SM

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 20 S SM

Datenblatt

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 315 50 G

SL 6 315 50 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 315 50 G

Datenblatt

SL 6 315 - Active Header Male Pin 0.100" (2.54mm) 50 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.606" (40.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 9 SMD 055 14 S

SLY 9 SMD 055 14 S

0.5 MM

Fischer Elektronik

0 -
RFQ
SLY 9 SMD 055 14 S

Datenblatt

SLY 9 SMD 055 Bulk Active Header Male Pin 0.079" (2.00mm) 14 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.217" (5.50mm) 0.130" (3.30mm) 0.406" (10.30mm) 0.059" (1.50mm) Circular Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 525 4 G

SL 6 525 4 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 525 4 G

Datenblatt

SL 6 525 - Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.421" (61.50mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL LP 6 SMD 066 20 G B SM

SL LP 6 SMD 066 20 G B SM

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 20 G B SM

Datenblatt

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 16 SMD 182 10 S

SL 16 SMD 182 10 S

0.635 MM FOR INTERCONNECTION

Fischer Elektronik

0 -
RFQ
SL 16 SMD 182 10 S

Datenblatt

SL 16 SMD 182 Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.236" (6.00mm) - - 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL LP 6 SMD 066 20 G PS

SL LP 6 SMD 066 20 G PS

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 20 G PS

Datenblatt

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 16 SMD 182 50 S

SL 16 SMD 182 50 S

0.635 MM FOR INTERCONNECTION

Fischer Elektronik

0 -
RFQ
SL 16 SMD 182 50 S

Datenblatt

SL 16 SMD 182 Bulk Active Header Male Pin 0.100" (2.54mm) 50 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.236" (6.00mm) - - 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 8 G

SLV W 8 117 8 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 8 G

Datenblatt

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 8 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 20 THR 112 21 G

SL 20 THR 112 21 G

0.635 MM, THR SOLDERING TECHNI

Fischer Elektronik

0 -
RFQ
SL 20 THR 112 21 G

Datenblatt

SL 20 THR 112 Bulk Active Header Male Pin 0.100" (2.54mm) 21 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.252" (6.40mm) 0.079" (2.00mm) 0.441" (11.20mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 092 46 Z

SLV W 8 092 46 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 46 Z

Datenblatt

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 46 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 2 025 64 G

SL 2 025 64 G

TWO ROWS, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 2 025 64 G

Datenblatt

SL 2 025 Bulk Active Header Male Pin 0.100" (2.54mm) 64 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.228" (5.80mm) 0.102" (2.60mm) 0.441" (11.20mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 117 12 G

SLV W 8 117 12 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 12 G

Datenblatt

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 12 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 081 22 Z

SLY 1 081 22 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 081 22 Z

Datenblatt

SLY 1 081 Bulk Active Header Male Pin 0.079" (2.00mm) 22 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 2 053 58 S

SL 2 053 58 S

TWO ROWS, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 2 053 58 S

Datenblatt

SL 2 053 Bulk Active Header Male Pin 0.100" (2.54mm) 58 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.209" (5.30mm) 0.228" (5.80mm) 0.547" (13.90mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 117 18 G

SLV W 7 117 18 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 18 G

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 18 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 2 078 36 S

SL 2 078 36 S

TWO ROWS, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 2 078 36 S

Datenblatt

SL 2 078 Bulk Active Header Male Pin 0.100" (2.54mm) 36 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.307" (7.80mm) 0.228" (5.80mm) 0.646" (16.40mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 117 64 Z

SLV W 7 117 64 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 64 Z

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 64 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
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