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Stiftleisten, Stiftkontakte
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Anschlusstyp | Kontakttyp | Abstand - Paarung | Anzahl der Positionen | Anzahl der Reihen | Reihenabstand - Paarung | Anzahl der geladenen Positionen | Stil | Ummantelung | Montageart | Anschluss | Befestigungstyp | Kontaktlänge - Paarung | Kontaktlänge - Pfosten | Gesamtkontaktlänge | Isolierhöhe | Kontaktform | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktoberfläche - Pfosten | Kontaktmaterial | Isoliermaterial | Funktionen | Betriebstemperatur | Stromstärke (Ampere) |
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SL LP 6 SMD 066 70 G SM PS0.635 MM, LOW PROFILE IN SMD-T |
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Datenblatt |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 70 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 315 21 GONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 315 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 21 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.606" (40.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 040 36 G0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 156 20 ZONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 156 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.980" (24.90mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 62 Z0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 360 4 GONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 360 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 4 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.783" (45.30mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 58 Z0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 58 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 197 12 SONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 197 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.142" (29.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 48 S B TR PS0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 237 21 GONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 237 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 21 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.299" (33.00mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 62 Z PS0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 5 147 19 ZONE ROW, 0.635 MM |
0 | - |
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Datenblatt |
SL 5 147 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 19 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 0.945" (24.00mm) | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 030 19 S0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 19 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLK 3 025 13 ZMALE HEADER 0.635 MM, DIMENSIO |
0 | - |
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Datenblatt |
SLK 3 025 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.118" (3.00mm) | - | 0.110" (2.80mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 030 25 Z0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 360 20 G0.635 MM"S" SE |
0 | - |
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Datenblatt |
SL 6 360 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.783" (45.30mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 36 G B SM0.5 MM |
0 | - |
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Datenblatt |
SLY 9 SMD 040 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 360 24 Z0.635 MM"S" SE |
0 | - |
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Datenblatt |
SL 6 360 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.783" (45.30mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 26 G SM PS0.635 MM, LOW PROFILE IN SMD-T |
0 | - |
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Datenblatt |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 26 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL 6 285 50 Z0.635 MM"S" SE |
0 | - |
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Datenblatt |
SL 6 285 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.130" (3.30mm) | 1.488" (37.80mm) | 0.110" (2.80mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 3A |
