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Startseite > Produkte > Steckverbinder, Verbindungselemente > Sockel für ICs, Transistoren > Sockeladapter

Sockeladapter

Hersteller	Serie	Verpackung	Produktstatus	Konvertieren von (Adapterende)	Konvertieren nach (Adapterende)	Anzahl der Stifte	Abstand - Paarung	Kontaktoberfläche – Paarung	Montageart	Anschluss	Abstand - Pfosten	Kontaktoberfläche - Pfosten	Gehäusematerial	Platinenmaterial
3M Analog Devices Inc./Maxim Integrated Aries Electronics Logical Systems Corp. MikroElektronika TE Connectivity DEUTSCH Connectors Xeltek	* - 647 Correct-A-Chip® Correct-A-Chip® 1106396 Correct-A-Chip® 1107254 Correct-A-Chip® 1109342 Correct-A-Chip® 1109522 Correct-A-Chip® 1109523 Correct-A-Chip® 1110087 Correct-A-Chip® 1110267-N Correct-A-Chip® 1111163 Correct-A-Chip® 1111841 Correct-A-Chip® 1111903 Correct-A-Chip® 301296 Correct-A-Chip® 301550 Correct-A-Chip® 304235 Correct-A-Chip® 304504 Correct-A-Chip® 304538 Correct-A-Chip® 305263 Correct-A-Chip® 305479 Correct-A-Chip® 307349 Correct-A-Chip® 350000 Correct-A-Chip® 351000 Correct-A-Chip® 352000 Correct-A-Chip® 353000 Correct-A-Chip® 354000 Correct-A-Chip® 354W00 Correct-A-Chip® 35W000 Correct-A-Chip® 450001 Correct-A-Chip® 505 Correct-A-Chip® 555000 Correct-A-Chip® 650000 Correct-A-Chip® 651000 Correct-A-Chip® 652000 Correct-A-Chip® 653000 Correct-A-Chip® 655000 Correct-A-Chip® 6645 Correct-A-Chip® 665000 Correct-A-Chip® 666000 Correct-A-Chip® 95-132I25 Correct-A-Chip® 96-160M65 Correct-A-Chip® 96-208M50 Correct-A-Chip® 97-56001 Correct-A-Chip® 97-68340 Correct-A-Chip® 97-AQ132D DS9075 DX Textool™	- Bag Box Bulk Retail Package Tube	Active Discontinued at Key Obsolete	- AT90PWM2 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing HB2E Relay MSOP Multiple Packages PLCC PQFP QFP SIP Socket, 0.6" (15.24mm) Row Spacing SOIC SOIC-W SOJ SOWIC SSOP TQFP TSOP VQFP	- DIP DIP, 0.3" (7.62mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing JEDEC PGA PLCC QFP SOIC SOWIC	- 10 100 12 128 132 14 144 16 160 169 18 184 20 208 22 24 28 32 36 40 42 44 48 52 56 60 64 68 8 80 84 90	- 0.020" (0.50mm) 0.024" (0.60mm) 0.025" (0.64mm) 0.026" (0.65mm) 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- Gold Silver Tin Tin-Lead	- Surface Mount Through Hole	- Solder Wire Wrap	- 0.031" (0.80mm) 0.050" (1.27mm) 0.070" (1.78mm) 0.100" (2.54mm)	- Gold Tin Tin-Lead	- Polyamide (PA46), Nylon 4/6, Glass Filled Polyester Polyphenylene Sulfide (PPS) Polysulfone (PSU), Glass Filled	- FR4 Epoxy Glass Polyimide (PI)

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Foto	Hersteller-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Konvertieren von (Adapterende)	Konvertieren nach (Adapterende)	Anzahl der Stifte	Abstand - Paarung	Kontaktoberfläche – Paarung	Montageart	Anschluss	Abstand - Pfosten	Kontaktoberfläche - Pfosten	Gehäusematerial	Platinenmaterial

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