IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
03-0518-10H

03-0518-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
RFQ
03-0518-10H

Datenblatt

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-308-41-003101

115-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
115-87-308-41-003101

Datenblatt

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X06-157B

SIP050-1X06-157B

1X06-157B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X06-157B

Datenblatt

SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-87-310-41-005101

110-87-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-87-310-41-005101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-012-05-001101

510-87-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip

0 -
RFQ
510-87-012-05-001101

Datenblatt

510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-304-31-012101

614-83-304-31-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
614-83-304-31-012101

Datenblatt

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
245-22-1-03

245-22-1-03

CONN IC DIP SOCKET 22POS TIN

CNC Tech

0 -
RFQ
245-22-1-03

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
SIP050-1X05-160B

SIP050-1X05-160B

1X05-160B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X05-160B

Datenblatt

SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
115-87-308-41-001101

115-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-99-032-17-400000

940-99-032-17-400000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
940-99-032-17-400000

Datenblatt

940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-83-306-41-001101

110-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
110-83-306-41-001101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-312-41-001101

110-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
110-87-312-41-001101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS32-Z

A-CCS32-Z

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS32-Z

Datenblatt

- Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
DIP316-011B

DIP316-011B

DIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP316-011B

Datenblatt

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
A08-LCG-T-R

A08-LCG-T-R

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
RFQ
A08-LCG-T-R

Datenblatt

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-CCS28-Z

A-CCS28-Z

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS28-Z

Datenblatt

- Bag Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
AW 127-22/Z-T

AW 127-22/Z-T

SOCKET 22 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-22/Z-T

Datenblatt

- - Active - - - - - - - - - - - - - - -
A 22-LC-TT

A 22-LC-TT

IC-SOCKETS

Assmann WSW Components

0 -
RFQ

-

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
146-87-304-41-035101

146-87-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
146-87-304-41-035101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X02-041B

SIP1X02-041B

SIP1X02-041B-SIP SOCKET 2 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X02-041B

Datenblatt

SIP1x Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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