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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
APH-1836-G-R

APH-1836-G-R

APH-1836-G-R

Samtec Inc.

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RFQ

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APH-0536-G-R

APH-0536-G-R

APH-0536-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1436-G-R

APH-1436-G-R

APH-1436-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0936-G-R

APH-0936-G-R

APH-0936-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1036-G-R

APH-1036-G-R

APH-1036-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-R

APH-1536-G-R

APH-1536-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0736-G-R

APH-0736-G-R

APH-0736-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0836-G-R

APH-0836-G-R

APH-0836-G-R

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0336-G-R

APH-0336-G-R

APH-0336-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1636-G-R

APH-1636-G-R

APH-1636-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0436-G-R

APH-0436-G-R

APH-0436-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-R

APH-0636-G-R

APH-0636-G-R

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
48-3570-11

48-3570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3570-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3571-11

48-3571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3571-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3573-11

48-3573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3573-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3575-11

48-3575-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

0 -
RFQ
48-3575-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6570-11

48-6570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6570-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6571-11

48-6571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6571-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6572-11

48-6572-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6572-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6573-11

48-6573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6573-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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