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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
APH-1522-G-H

APH-1522-G-H

APH-1522-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1022-G-H

APH-1022-G-H

APH-1022-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0222-G-H

APH-0222-G-H

APH-0222-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0322-G-H

APH-0322-G-H

APH-0322-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0422-G-H

APH-0422-G-H

APH-0422-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
121-13-964-41-001000

121-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
121-13-964-41-001000

Datenblatt

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-648-61-006000

116-93-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0520-S-2

HLS-0520-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0520-S-2

Datenblatt

HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
117-93-652-61-005000

117-93-652-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-225-17-003135

546-83-225-17-003135

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
RFQ
546-83-225-17-003135

Datenblatt

546 Bulk Active PGA 225 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-13-648-61-001000

110-13-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-964-61-001000

110-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0320-T-18

HLS-0320-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0320-T-18

Datenblatt

HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-43-640-61-801000

110-43-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-61-801000

110-93-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-176-15-061002

510-93-176-15-061002

CONN PGA SOCKET 176PIN 15X15

Mill-Max Manufacturing Corp.

0 -
RFQ

-

510 Tube Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-642-61-007000

116-93-642-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-87-238-19-101112

614-87-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip

0 -
RFQ
614-87-238-19-101112

Datenblatt

614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
517-87-565-21-111111

517-87-565-21-111111

CONN SOCKET PGA 565POS GOLD

Preci-Dip

0 -
RFQ
517-87-565-21-111111

Datenblatt

517 Bulk Active PGA 565 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
36-3570-11

36-3570-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

0 -
RFQ
36-3570-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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