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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
517-83-365-14-000111

517-83-365-14-000111

CONN SOCKET PGA 365POS GOLD

Preci-Dip

0 -
RFQ
517-83-365-14-000111

Datenblatt

517 Bulk Active PGA 365 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-13-952-41-001000

612-13-952-41-001000

SOCKET CARRIER SLDRTL .900 52POS

Mill-Max Manufacturing Corp.

0 -
RFQ
612-13-952-41-001000

Datenblatt

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-3551-11

40-3551-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

0 -
RFQ
40-3551-11

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-3554-11

40-3554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

0 -
RFQ
40-3554-11

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
APH-1924-G-R

APH-1924-G-R

APH-1924-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0524-G-R

APH-0524-G-R

APH-0524-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0325-G-H

APH-0325-G-H

APH-0325-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1224-G-R

APH-1224-G-R

APH-1224-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0324-G-R

APH-0324-G-R

APH-0324-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1324-G-R

APH-1324-G-R

APH-1324-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0824-G-R

APH-0824-G-R

APH-0824-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0224-G-R

APH-0224-G-R

APH-0224-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
32-6571-11

32-6571-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

0 -
RFQ
32-6571-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6573-11

32-6573-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
RFQ
32-6573-11

Datenblatt

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
110-43-316-61-801000

110-43-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-316-61-801000

110-93-316-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
121-13-952-41-001000

121-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
121-13-952-41-001000

Datenblatt

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-642-61-001000

111-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-642-61-001000

111-93-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-318-G-T

APO-318-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ

-

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