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| Foto | Hersteller-Teilenr. | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Typ | Anzahl der Positionen oder Stifte (Gitter) | Abstand - Paarung | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Kontaktmaterial - Paarung | Montageart | Funktionen | Anschluss | Abstand - Pfosten | Kontaktoberfläche - Pfosten | Kontaktoberflächendicke - Pfosten | Kontaktmaterial - Pfosten | Gehäusematerial | Betriebstemperatur |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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116-43-642-41-007000CONN IC SKT DBL |
0 | - |
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Datenblatt |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
APH-1916-G-RAPH-1916-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0916-G-RAPH-0916-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1416-G-RAPH-1416-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0516-G-RAPH-0516-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1016-G-RAPH-1016-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1516-G-RAPH-1516-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1116-G-RAPH-1116-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1616-G-RAPH-1616-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0416-G-RAPH-0416-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1716-G-RAPH-1716-G-R |
0 | - |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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123-93-324-41-801000CONN IC DIP SOCKET 24POS GOLD |
0 | - |
|
Datenblatt |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
123-43-324-41-801000CONN IC SKT DBL |
0 | - |
|
Datenblatt |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
122-13-314-41-801000CONN IC DIP SOCKET 14POS GOLD |
0 | - |
|
Datenblatt |
122 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
65-PGM10008-11CONN SOCKET PGA GOLD |
0 | - |
|
Datenblatt |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
110-41-310-61-001000CONN IC SKT DBL |
0 | - |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-91-310-61-001000CONN IC SKT DBL |
0 | - |
|
- |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-41-640-61-001000CONN IC SKT DBL |
0 | - |
|
- |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
104-11-640-41-780000CONN IC SKT DBL |
0 | - |
|
Datenblatt |
104 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
116-93-650-41-006000CONN IC DIP SOCKET 50POS GOLD |
0 | - |
|
Datenblatt |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
