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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
44-3554-10

44-3554-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
RFQ
44-3554-10

Datenblatt

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
115-93-650-41-003000

115-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
115-93-650-41-003000

Datenblatt

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-650-41-003000

115-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-43-650-41-003000

Datenblatt

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-640-41-007000

116-41-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-640-41-007000

Datenblatt

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-640-41-007000

116-91-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-640-41-007000

Datenblatt

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-632-61-001000

110-43-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-632-61-001000

110-93-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-632-61-001000

110-99-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-C182-20

24-C182-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C182-20

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C182-30

24-C182-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C182-30

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C212-20

24-C212-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C212-20

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C212-30

24-C212-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C212-30

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C300-20

24-C300-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C300-20

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-C300-30

24-C300-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-C300-30

Datenblatt

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0515-G-H

APH-0515-G-H

APH-0515-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
24-6553-11

24-6553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
RFQ

-

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
124-41-210-41-002000

124-41-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
124-41-210-41-002000

Datenblatt

124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-210-41-002000

124-91-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
124-91-210-41-002000

Datenblatt

124 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-322-41-004000

612-43-322-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-43-322-41-004000

Datenblatt

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-422-41-004000

612-43-422-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-43-422-41-004000

Datenblatt

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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