IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
APO-308-T-H

APO-308-T-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-308-T-H

Datenblatt

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
2-1571550-8

2-1571550-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571550-8

Datenblatt

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
524-AG11D

524-AG11D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

1,444 -
RFQ
524-AG11D

Datenblatt

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Polyester -55°C ~ 125°C
2-1571586-4

2-1571586-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571586-4

Datenblatt

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
2-1571551-9

2-1571551-9

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571551-9

Datenblatt

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
524-AG11D-ESL

524-AG11D-ESL

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

259 -
RFQ
524-AG11D-ESL

Datenblatt

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
ICO-308-LTT

ICO-308-LTT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

0 -
RFQ
ICO-308-LTT

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICF-308-T-I

ICF-308-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ

-

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APO-314-T-A

APO-314-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-314-T-A

Datenblatt

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
1-1825376-3

1-1825376-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1-1825376-3

Datenblatt

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
ICO-308-MTT

ICO-308-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-308-MTT

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-314-STT

ICA-314-STT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-314-STT

Datenblatt

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICF-308-TM-O-TR

ICF-308-TM-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ

-

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
808-AG10D

808-AG10D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
808-AG10D

Datenblatt

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Polyester -55°C ~ 105°C
820-AG11D

820-AG11D

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
820-AG11D

Datenblatt

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
6-1437537-6

6-1437537-6

6-1437537-6

TE Connectivity AMP Connectors

9,007 -
RFQ
6-1437537-6

Datenblatt

* Box Active - - - - - - - - - - - - - - -
2134928-2

2134928-2

CONN SOCKET LGA 1150POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2134928-2

Datenblatt

- Bulk Obsolete LGA 1150 0.036" (0.91mm) Gold 3.90µin (0.099µm) Copper Alloy Surface Mount Closed Frame Solder 0.036" (0.91mm) - - - Thermoplastic -
1-1814655-3

1-1814655-3

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1-1814655-3

Datenblatt

- Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
ICO-308-SST

ICO-308-SST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-308-SST

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
2-1571586-8

2-1571586-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571586-8

Datenblatt

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
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