IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
110-83-316-10-003101

110-83-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,664 -
RFQ
110-83-316-10-003101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2445893-3

2445893-3

DIP IC SOCKET 20P SMT

TE Connectivity AMP Connectors

3,000 -
RFQ
2445893-3

Datenblatt

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
D2608-42

D2608-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,312 -
RFQ
D2608-42

Datenblatt

D26 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2485264-4

2485264-4

DIP IC SOCKET 18P,GOLD FLASH

TE Connectivity AMP Connectors

5,280 -
RFQ
2485264-4

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2445893-2

2445893-2

DIP IC SOCKET 16P SMT

TE Connectivity AMP Connectors

3,000 -
RFQ
2445893-2

Datenblatt

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
ICO-308-STT

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

111 -
RFQ
ICO-308-STT

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
2485264-7

2485264-7

DIP IC SOCKET 28P,GOLD FLASH

TE Connectivity AMP Connectors

3,822 -
RFQ
2485264-7

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
116-83-314-41-006101

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,396 -
RFQ
116-83-314-41-006101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SMPX-52LCC-P

SMPX-52LCC-P

SMT PLCC SOCKET 52P POLARISED RO

Kycon, Inc.

203 -
RFQ
SMPX-52LCC-P

Datenblatt

SMPX Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
146-43-308-41-013000

146-43-308-41-013000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

120 -
RFQ
146-43-308-41-013000

Datenblatt

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-83-320-41-001101

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

237 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-624-41-001101

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,016 -
RFQ
110-83-624-41-001101

Datenblatt

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-44-032-17-400004

940-44-032-17-400004

CONN SOCKET PLCC 32POS SMD

Mill-Max Manufacturing Corp.

390 -
RFQ
940-44-032-17-400004

Datenblatt

940 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
ICO-314-MTT

ICO-314-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

11 -
RFQ
ICO-314-MTT

Datenblatt

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
8452-21B1-RK-TR

8452-21B1-RK-TR

CONN SOCKET PLCC 52POS TIN

3M

1,857 -
RFQ
8452-21B1-RK-TR

Datenblatt

8400 Tape & Reel (TR) Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
4602

4602

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

1,759 -
RFQ
4602

Datenblatt

- Bulk Active Transistor, TO-3 3 (Oval) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
2485265-1

2485265-1

DIP IC SOCKET 40P,GOLD FLASH

TE Connectivity AMP Connectors

1,950 -
RFQ
2485265-1

Datenblatt

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
540-44-032-17-400004

540-44-032-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

800 -
RFQ
540-44-032-17-400004

Datenblatt

540 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
123-83-316-41-001101

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,058 -
RFQ
123-83-316-41-001101

Datenblatt

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-93-424-41-001000

110-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

183 -
RFQ
110-93-424-41-001000

Datenblatt

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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