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Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
110-87-322-41-005101

110-87-322-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
110-87-322-41-005101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
09-0513-10T

09-0513-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
RFQ
09-0513-10T

Datenblatt

0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-0518-11

08-0518-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
RFQ
08-0518-11

Datenblatt

518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
122-87-310-41-001101

122-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
122-87-310-41-001101

Datenblatt

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS052-Z-SM/T

A-CCS052-Z-SM/T

SOCKET

Assmann WSW Components

0 -
RFQ
A-CCS052-Z-SM/T

Datenblatt

- Bulk Active PLCC 52 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AR18-HZW/T

AR18-HZW/T

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
RFQ
AR18-HZW/T

Datenblatt

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
0473370001

0473370001

CONN CAM SOCKET 24POS GOLD

Molex

0 -
RFQ
0473370001

Datenblatt

47337 Tape & Reel (TR) Obsolete Camera Socket 24 (4 x 6) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold Flash Copper Alloy Polyamide (PA), Nylon -55°C ~ 85°C
410-87-220-10-001101

410-87-220-10-001101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip

0 -
RFQ
410-87-220-10-001101

Datenblatt

410 Bulk Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-87-220-10-002101

410-87-220-10-002101

CONN ZIG-ZAG 20POS GOLD

Preci-Dip

0 -
RFQ
410-87-220-10-002101

Datenblatt

410 Bulk Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-320-41-117101

114-87-320-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
114-87-320-41-117101

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-320-41-134161

114-87-320-41-134161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
114-87-320-41-134161

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-314-41-001101

115-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-310-41-035101

146-87-310-41-035101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
146-87-310-41-035101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-310-41-036101

146-87-310-41-036101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
146-87-310-41-036101

Datenblatt

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D01-9972142

D01-9972142

CONN SOCKET SIP 21POS GOLD

Harwin Inc.

0 -
RFQ
D01-9972142

Datenblatt

D01-997 Tube Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
212-1-08-003

212-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

0 -
RFQ
212-1-08-003

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
116-87-210-41-008101

116-87-210-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-210-41-008101

Datenblatt

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-310-41-008101

116-87-310-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-310-41-008101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-610-41-018101

116-83-610-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-610-41-018101

Datenblatt

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-41-001101

110-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
110-83-316-41-001101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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