IC-Sockel

Hersteller Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Anzahl der Positionen oder Stifte (Gitter) Abstand - Paarung Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktmaterial - Paarung Montageart Funktionen Anschluss Abstand - Pfosten Kontaktoberfläche - Pfosten Kontaktoberflächendicke - Pfosten Kontaktmaterial - Pfosten Gehäusematerial Betriebstemperatur
123-83-306-41-001101

123-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
123-83-306-41-001101

Datenblatt

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 10-HZW/TN

AR 10-HZW/TN

CONN IC DIP SOCKET 4POS TIN

Assmann WSW Components

0 -
RFQ
AR 10-HZW/TN

Datenblatt

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
114-87-314-41-117101

114-87-314-41-117101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
114-87-314-41-117101

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-314-41-134161

114-87-314-41-134161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
114-87-314-41-134161

Datenblatt

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
231-32

231-32

CONN SOCKET PLCC 32POS GOLD

CNC Tech

0 -
RFQ
231-32

Datenblatt

- Tube Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
SIP050-1X10-157B

SIP050-1X10-157B

1X10-157B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X10-157B

Datenblatt

SIP050-1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR 50-HZL-TT

AR 50-HZL-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DILB42P-223TLF

DILB42P-223TLF

CONN IC DIP SOCKET 42POS TINLEAD

Amphenol ICC (FCI)

0 -
RFQ
DILB42P-223TLF

Datenblatt

DILB Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
116-87-310-41-018101

116-87-310-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-310-41-018101

Datenblatt

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-420-41-001101

110-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
110-87-420-41-001101

Datenblatt

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X20-011B

SIP1X20-011B

SIP1X20-011B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X20-011B

Datenblatt

SIP1x Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
917-83-103-41-005101

917-83-103-41-005101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip

0 -
RFQ
917-83-103-41-005101

Datenblatt

917 Bulk Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
917-83-103-41-053101

917-83-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip

0 -
RFQ
917-83-103-41-053101

Datenblatt

917 Bulk Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
6-513-10

6-513-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
6-513-10

Datenblatt

0513 Bulk Obsolete SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-83-308-41-001101

614-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
614-83-308-41-001101

Datenblatt

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-314-10-002101

110-87-314-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-87-314-10-002101

Datenblatt

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 8 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-210-41-001101

115-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-310-41-001101

115-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-306-41-001101

121-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
121-83-306-41-001101

Datenblatt

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS 032-Z-SM/T

A-CCS 032-Z-SM/T

IC SOCKET, CHIP CARRIER, 1.27MM,

Assmann WSW Components

0 -
RFQ
A-CCS 032-Z-SM/T

Datenblatt

- Tape & Reel (TR) Active PLCC 32 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
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