RFI und EMI - Kontakte, Fingerstock und Dichtungen

Hersteller Serie Verpackung Produktstatus Typ Form Breite Länge Höhe Material Beschichtung Beschichtung - Dicke Befestigungsmethode Betriebstemperatur

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Typ Form Breite Länge Höhe Material Beschichtung Beschichtung - Dicke Befestigungsmethode Betriebstemperatur
0097050006

0097050006

RFI FINGERSTOCK BECU CADMIUM ADH

Laird Technologies EMI

0 -
RFQ
0097050006

Datenblatt

All-Purpose Bulk Active Fingerstock - 0.600" (15.24mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Cadmium + Clear Chromate 299.21µin (7.60µm) Adhesive 121°C
0097051517

0097051517

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097051517

Datenblatt

Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097051519

0097051519

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
RFQ
0097051519

Datenblatt

Foldover Bulk Active Fingerstock - 0.760" (19.30mm) 24.000" (609.60mm) 0.230" (5.84mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097052117

0097052117

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097052117

Datenblatt

Foldover Bulk Active Fingerstock - 0.510" (12.95mm) 16.000" (406.40mm) 0.140" (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097052717

0097052717

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097052717

Datenblatt

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.055" (1.40mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097054001

0097054001

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
RFQ
0097054001

Datenblatt

All-Purpose Bulk Active Fingerstock - 0.280" (7.11mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper - - Adhesive 121°C
0097054201

0097054201

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
RFQ
0097054201

Datenblatt

Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper - - Adhesive 121°C
0097054215

0097054215

RFI FINGERSTOCK BECU ZINC ADH

Laird Technologies EMI

0 -
RFQ
0097054215

Datenblatt

Foldover Bulk Active Fingerstock - 0.250" (6.35mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive 121°C
0097054417

0097054417

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097054417

Datenblatt

All-Purpose Bulk Active Fingerstock - 0.260" (6.60mm) 16.000" (406.40mm) 0.110" (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097055001

0097055001

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
RFQ
0097055001

Datenblatt

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper - - Adhesive 121°C
0097055005

0097055005

RFI FINGERSTOCK BECU ZINC ADH

Laird Technologies EMI

0 -
RFQ
0097055005

Datenblatt

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive 121°C
0097055009

0097055009

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
RFQ
0097055009

Datenblatt

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097055015

0097055015

RFI FINGERSTOCK BECU ZINC ADH

Laird Technologies EMI

0 -
RFQ
0097055015

Datenblatt

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Zinc + Clear Chromate 299.21µin (7.60µm) Adhesive 121°C
0097055317

0097055317

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097055317

Datenblatt

Clip-On Twist Bulk Active Fingerstock - 0.150" (3.81mm) 16.000" (406.40mm) 0.030" (0.76mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097055318

0097055318

RFI FINGERSTOCK BECU NICKEL ADH

Laird Technologies EMI

0 -
RFQ
0097055318

Datenblatt

Clip-On Twist Bulk Active Fingerstock - 0.150" (3.81mm) 16.000" (406.40mm) 0.030" (0.76mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive 121°C
0097055507

0097055507

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097055507

Datenblatt

Twist Bulk Active Fingerstock - 0.230" (5.84mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Lead, Tin 299.21µin (7.60µm) Adhesive 121°C
0097055608

0097055608

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097055608

Datenblatt

Twist Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
0097055616

0097055616

RFI FINGERSTOCK BECU ZINC ADH

Laird Technologies EMI

0 -
RFQ
0097055616

Datenblatt

Twist Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Zinc + Yellow Chromate 299.21µin (7.60µm) Adhesive 121°C
0097056001

0097056001

RFI FINGERSTOCK BECU ADH

Laird Technologies EMI

0 -
RFQ
0097056001

Datenblatt

Twist Bulk Active Fingerstock - 0.500" (12.70mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper - - Adhesive 121°C
0097056017

0097056017

RFI FINGERSTOCK BECU TIN ADH

Laird Technologies EMI

0 -
RFQ
0097056017

Datenblatt

Twist Bulk Active Fingerstock - 0.500" (12.70mm) 24.000" (609.60mm) 0.070" (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive 121°C
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