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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
150-10-320-01-899161 CONN HDR DIP MALE PIN 20POS GOLD Preci-Dip	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	20	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Gold	10.0µin (0.25µm)	Black
04-6625-31 CONN HDR DIP SOLDER 4POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Solder Cup	4	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
05-0625-71 CONN HDR STRIP POST 5POS GOLD Aries Electronics	-	RFQ	Datenblatt	0625	Bulk	Active	Header Strip	Post	5	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
160-10-310-00-001101 CONN HDR DIP SLOT 10POS GOLD Preci-Dip	-	RFQ	Datenblatt	160	Bulk	Active	DIP, DIL - Header	Slotted	10	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
180-10-310-00-001101 CONN HDR DIP SOLDER 10POS GOLD Preci-Dip	-	RFQ	Datenblatt	180	Bulk	Active	DIP, DIL - Header	Solder Cup	10	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
160-80-318-00-001101 CONN HDR DIP SLOT 18POS TIN Preci-Dip	-	RFQ	Datenblatt	160	Bulk	Active	DIP, DIL - Header	Slotted	18	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	-	Black
180-80-318-00-001101 CONN HDR DIP SOLDER 18POS TIN Preci-Dip	-	RFQ	Datenblatt	180	Bulk	Active	DIP, DIL - Header	Solder Cup	18	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	-	Black
460-80-216-00-001101 CONN HDR STRIP SLOT 16POS TIN Preci-Dip	-	RFQ	Datenblatt	460	Bulk	Active	Header Strip	Slotted	16	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Tin	-	Black
360-80-117-00-001101 CONN HDR STRIP SLOT 17POS TIN Preci-Dip	-	RFQ	Datenblatt	360	Bulk	Active	Header Strip	Slotted	17	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
480-80-216-00-001101 CONN HDR STRIP SOLDER 16POS TIN Preci-Dip	-	RFQ	Datenblatt	480	Bulk	Active	Header Strip	Solder Cup	16	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Tin	-	Black
150-80-428-00-106101 CONN HDR DIP MALE PIN 28POS TIN Preci-Dip	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	28	0.100" (2.54mm)	2	0.400" (10.16mm)	Surface Mount	Solder	-	Tin	-	Black
150-80-628-00-106101 CONN HDR DIP MALE PIN 28POS TIN Preci-Dip	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	28	0.100" (2.54mm)	2	0.600" (15.24mm)	Surface Mount	Solder	-	Tin	-	Black
10-2625-10 CONN HDR DIP FORK 10POS TIN Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	10	0.100" (2.54mm)	2	0.200" (5.08mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
10-6625-21 CONN HDR DIP POST 10POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	10	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
12-0625-20 CONN HDR STRIP POST 12POS TIN Aries Electronics	-	RFQ	Datenblatt	0625	Bulk	Active	Header Strip	Post	12	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
HTS-120-T-J .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Mating Target	20	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
TS-105-G-G-1 .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	-	RFQ	Datenblatt	TS	Tube	Active	Header	Post	5	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
HTS-106-G-A-1 .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Post	6	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
12-6625-20 CONN HDR DIP POST 12POS TIN Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	12	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
HTS-105-G-B .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Solder Cup	5	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black

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