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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
151-10-306-00-016101 CONN HDR DIP MALE PIN 6POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	151	Bulk	Active	DIP, DIL - Header	Post	6	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
150-80-628-00-106161 CONN HDR DIP MALE PIN 28POS TIN Preci-Dip	0	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	28	0.100" (2.54mm)	2	0.600" (15.24mm)	Surface Mount	Solder	-	Tin	-	Black
HTS-108-T-B .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	0	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Solder Cup	8	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
151-80-328-00-003101 CONN HDR DIP MALE PIN 28POS TIN Preci-Dip	0	-	RFQ	Datenblatt	151	Bulk	Active	DIP, DIL - Header	Post	28	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	-	Black
151-10-316-00-003101 CONN HDR DIP MALE PIN 16POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	151	Bulk	Active	DIP, DIL - Header	Post	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
18-0600-11 CONN HDR DIP FORK 18POS GOLD Aries Electronics	0	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Forked	18	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
463-10-206-00-001101 CONN HDR STRIP SLOT 6POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	463	Bulk	Active	Header Strip	Slotted	6	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
HTS-110-G-J .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	0	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Mating Target	10	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
342-10-107-00-591000 CONN HDR DIP POST 7POS GOLD Mill-Max Manufacturing Corp.	1	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	7	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
151-10-314-00-004101 CONN HDR DIP MALE PIN 14POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	151	Bulk	Active	DIP, DIL - Header	Post	14	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
HTS-105-G-A-2 .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	0	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Post	5	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
04-6625-71 CONN HDR DIP POST 4POS GOLD Aries Electronics	0	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	4	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
370-80-122-00-001101 CONN HDR STRIP TURRET 22POS TIN Preci-Dip	0	-	RFQ	Datenblatt	370	Bulk	Active	Header Strip	Turret	22	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
TD-103-G-A-1 .100" DOUBLE ROW SCREW MACHINE T Samtec Inc.	0	-	RFQ	Datenblatt	TD	Bulk	Active	Header	Post	6	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
150-V3-314-00-106101 CONN HDR DIP MALE PIN 14POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	14	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Gold	29.5µin (0.75µm)	Black
150-V3-314-00-106161 CONN HDR DIP MALE PIN 14POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	14	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Gold	29.5µin (0.75µm)	Black
170-10-312-00-001101 CONN HDR DIP TURRET 12POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	170	Bulk	Active	DIP, DIL - Header	Turret	12	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
370-10-110-00-001101 CONN HDR STRIP TURRET 10POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	370	Bulk	Active	Header Strip	Turret	10	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
470-10-210-00-001101 CONN HDR STRIP TURRET 10POS GOLD Preci-Dip	0	-	RFQ	Datenblatt	470	Bulk	Active	Header Strip	Turret	10	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
HTS-106-G-A-2 .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	0	-	RFQ	Datenblatt	HTS	Bulk	Active	Header	Post	6	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black

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