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Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
AW 122-41/G-T PIN HEADER Assmann WSW Components	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	41	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
360-80-107-00-001101 CONN HDR STRIP SLOT 7POS TIN Preci-Dip	-	RFQ	Datenblatt	360	Bulk	Active	Header Strip	Slotted	7	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
08-680-191TC CONN HDR MALE PIN 8POS TIN Aries Electronics	-	RFQ	Datenblatt	680	Tray	Active	Header	-	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black
22-680-191T CONN HDR MALE PIN 22POS TIN Aries Electronics	-	RFQ	Datenblatt	680	Tray	Active	Header	-	22	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black
AW 122-34/G-T PIN HEADER Assmann WSW Components	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	34	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
150-80-316-00-001101 CONN HDR DIP MALE PIN 16POS TIN Preci-Dip	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	-	Black
150-80-316-00-018101 CONN HDR DIP MALE PIN 16POS TIN Preci-Dip	-	RFQ	Datenblatt	150	Bulk	Active	DIP, DIL - Header	Post	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	-	Black
150-80-308-00-106191 CONN HDR DIP MALE PIN 8POS TIN Preci-Dip	-	RFQ	-	150	Bulk	Active	DIP, DIL - Header	Post	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Tin	-	Black
8136-477P1 CONN PLUG MALE PIN 2POS GOLD TE Connectivity AMP Connectors	-	RFQ	Datenblatt	8136	Bulk	Active	Plug	-	2	-	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Gold	-	Black
380-80-106-00-001101 CONN HDR STRIP SOLDER 6POS TIN Preci-Dip	-	RFQ	Datenblatt	380	Bulk	Active	Header Strip	Solder Cup	6	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
AW 122-42/G-T PIN HEADER Assmann WSW Components	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	42	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
10-0600-10 CONN HDR DIP FORK 10POS TIN Aries Electronics	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Forked	10	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
10-0600-20 CONN SIL HDR POST 10POS TIN Aries Electronics	-	RFQ	Datenblatt	0600	Bulk	Active	SIP, SIL - Header	Post	10	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
06-680-191TC CONN HDR MALE PIN 6POS TIN Aries Electronics	-	RFQ	Datenblatt	680	Tray	Active	Header	-	6	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black
370-80-110-00-001101 CONN HDR STRIP TURRET 10POS TIN Preci-Dip	-	RFQ	Datenblatt	370	Bulk	Active	Header Strip	Turret	10	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
AR 40-ST/T PIN HEADER Assmann WSW Components	-	RFQ	-	-	Bulk	Active	DIP, DIL - Header	Post	40	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	Flash	Black
150-80-306-01-899191 CONN HDR DIP MALE PIN 6POS TIN Preci-Dip	-	RFQ	-	150	Bulk	Active	DIP, DIL - Header	Post	6	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Tin	-	Black
TD-102-G-J .100" DOUBLE ROW SCREW MACHINE T Samtec Inc.	-	RFQ	Datenblatt	TD	Bulk	Active	Header	Mating Target	4	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
TS-104-G-J .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	-	RFQ	Datenblatt	TS	Bulk	Active	Header	Mating Target	4	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
24-680-191T CONN HDR MALE PIN 24POS TIN Aries Electronics	-	RFQ	Datenblatt	680	Tray	Active	Header	-	24	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black

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