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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
342-10-127-00-594000 CONN HDR DIP POST 27POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	27	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
151-10-640-00-005000 CONN HDR DIP POST 40POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	151	Tube	Active	DIP, DIL - Header	Post, Extended	40	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-10-136-00-000000 CONN HDR POST 36POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	36	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
153-10-642-00-001000 CONN HDR DIP POST 42POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	153	Tube	Active	DIP, DIL - Header	Post	42	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
334-10-158-00-050000 CONN HDR POST 58POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	58	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
342-10-160-00-593000 CONN HDR DIP POST 60POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	60	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
342-10-132-00-594000 HEADER SOLDERTAIL SIP 32POS Mill-Max Manufacturing Corp.	-	RFQ	-	342	Tube	Active	DIP, DIL - Header	Post, Extended	32	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
852-10-090-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Bulk	Active	Header	Solder Cup	90	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-148-00-000000 CONN HDR POST 48POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	48	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-148-00-000000 CONN HDR POST 48POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	48	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
832-10-088-10-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	832	Bulk	Active	Header	Solder Cup	88	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
64-9625-11 CONN HDR DIP FORK 64POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	64	0.100" (2.54mm)	2	0.900" (22.86mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
342-90-164-00-593000 HEADER SOLDERTAIL SIP 64POS Mill-Max Manufacturing Corp.	-	RFQ	-	342	Tube	Active	DIP, DIL - Header	Post, Extended	64	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
480-10-260-00-001000 CONN HDR SOLDER 60POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	480	Bulk	Active	Header	Solder Cup	60	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-163-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	63	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
830-10-048-20-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	830	Bulk	Active	Header	Solder Cup	48	0.079" (2.00mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
832-10-100-10-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	832	Tube	Active	Header	Solder Cup	100	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-164-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Tube	Active	Header	Solder Cup	64	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
HTS-132-G-N .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Bulk	Active	Header	Post	32	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
360-10-154-00-001000 CONN HDR SLOT 54POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	54	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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