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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
334-10-160-00-020000 CONN HDR POST 60POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	60	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-131-00-000000 CONN HDR POST 31POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-131-00-000000 CONN HDR POST 31POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
852-40-076-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Bulk	Active	Header	Solder Cup	76	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
342-10-148-00-593000 CONN HDR DIP POST 48POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	48	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
832-10-062-10-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	832	Bulk	Active	Header	Solder Cup	62	0.079" (2.00mm)	2	0.079" (2.00mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-40-149-00-001000 CONN HDR SOLDER 49POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	49	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
380-90-149-00-001000 CONN HDR SOLDER 49POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	49	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
380-40-162-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	62	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
360-90-147-00-001000 CONN HDR SLOT 47POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	47	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
850-10-046-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	46	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
363-10-150-00-001101 CONN HDR STRIP SLOT 50POS GOLD Preci-Dip	-	RFQ	Datenblatt	363	Bulk	Active	Header Strip	Slotted	50	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
26-6625-51 CONN HDR DIP FORK 26POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	26	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
334-10-147-00-010000 CONN HDR POST 47POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	47	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
HTS-132-G-K .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Bulk	Active	Header	Post, Extended	32	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
134-10-322-00-000000 CONN HDR DIP POST 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	22	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
134-10-422-00-000000 CONN HDR DIP POST 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	22	0.100" (2.54mm)	2	0.400" (10.16mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
370-10-155-00-001000 CONN HDR TURRET 55POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	55	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-160-00-050000 CONN HDR POST 60POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	60	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-160-00-050000 CONN HDR POST 60POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	60	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black

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