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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
151-10-624-00-005000 CONN HDR DIP POST 24POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	151	Tube	Active	DIP, DIL - Header	Post, Extended	24	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
170-10-648-00-001000 CONN HDR DIP TURRET 48POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	170	Tube	Active	DIP, DIL - Header	Turret	48	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-136-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	36	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-139-00-001000 CONN HDR SOLDER 39POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	39	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-40-155-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	55	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
334-40-153-00-050000 CONN HDR POST 53POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	53	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-153-00-050000 CONN HDR POST 53POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	53	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
383-10-151-00-001101 CONN HDR STRIP SOLDER 51POS GOLD Preci-Dip	-	RFQ	Datenblatt	383	Bulk	Active	Header Strip	Solder Cup	51	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
370-10-149-00-001000 CONN HDR TURRET 49POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	49	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
160-10-640-00-001000 CONN HDR DIP SLOT 40POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	160	Tube	Active	DIP, DIL - Header	Slotted	40	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
850-10-041-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	41	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
24-0625-51 CONN HDR STRIP FORK 24POS GOLD Aries Electronics	-	RFQ	Datenblatt	0625	Bulk	Active	Header Strip	Forked	24	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
48-6625-21 CONN HDR DIP POST 48POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	48	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
48-6625-31 CONN HDR DIP SOLDER 48POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Solder Cup	48	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
852-40-068-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Bulk	Active	Header	Solder Cup	68	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
360-40-142-00-001000 CONN HDR SLOT 42POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	42	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
360-90-142-00-001000 CONN HDR SLOT 42POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	42	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
334-40-159-00-010000 CONN HDR POST 59POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	59	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-159-00-010000 CONN HDR POST 59POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	59	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
342-10-145-00-593000 CONN HDR DIP POST 45POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	45	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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