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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
334-40-117-00-000000 CONN HDR POST 17POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	17	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
150-10-428-00-106000 CONN HDR DIP POST 28POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	28	0.100" (2.54mm)	2	0.400" (10.16mm)	Surface Mount	Solder	-	Gold	10.0µin (0.25µm)	Black
370-40-147-00-001000 CONN HDR TURRET 47POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	47	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
370-90-147-00-001000 CONN HDR TURRET 47POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	47	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
HTS-136-G-B .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	-	RFQ	Datenblatt	HTS	Tube	Active	Header	Solder Cup	36	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
463-10-240-00-001101 CONN HDR STRIP SLOT 40POS GOLD Preci-Dip	-	RFQ	Datenblatt	463	Bulk	Active	Header Strip	Slotted	40	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
150-90-652-00-001000 CONN HDR DIP POST 52POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	52	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
150-40-652-00-001000 CONN HDR DIP POST 52POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	52	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
850-40-030-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	30	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
360-40-127-00-001000 CONN HDR SLOT 27POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	27	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
360-90-127-00-001000 CONN HDR SLOT 27POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	27	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
360-10-119-00-001000 CONN HDR SLOT 19POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	360	Bulk	Active	Header	Slotted	19	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-90-138-00-010000 CONN HDR POST 38POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	38	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
334-10-127-00-010000 CONN HDR POST 27POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	27	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-154-00-001101 CONN HDR STRIP SOLDER 54POS GOLD Preci-Dip	-	RFQ	Datenblatt	380	Bulk	Active	Header Strip	Solder Cup	54	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
852-40-048-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Bulk	Active	Header	Solder Cup	48	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
64-9625-21 CONN HDR DIP POST 64POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	64	0.100" (2.54mm)	2	0.900" (22.86mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
830-10-025-10-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	830	Bulk	Active	Header	Solder Cup	25	0.079" (2.00mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
134-10-432-00-020000 CONN HDR DIP POST 32POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	32	0.100" (2.54mm)	2	0.400" (10.16mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
134-10-632-00-020000 CONN HDR DIP POST 32POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	32	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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