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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
134-10-422-00-050000 CONN HDR DIP POST 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	22	0.100" (2.54mm)	2	0.400" (10.16mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-40-132-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	32	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
334-40-146-00-020000 CONN HDR POST 46POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	46	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-146-00-020000 CONN HDR POST 46POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	46	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
373-10-160-00-001101 CONN HDR STRIP TURRET 60POS GOLD Preci-Dip	-	RFQ	Datenblatt	373	Bulk	Active	Header Strip	Turret	60	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
180-10-316-00-001000 CONN HDR DIP SOLDER 16POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	180	Tube	Active	DIP, DIL - Header	Solder Cup	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
850-40-027-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	27	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
30-3625-31 CONN HDR DIP SOLDER 30POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Solder Cup	30	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
150-10-424-00-106000 CONN HDR DIP POST 24POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	24	0.100" (2.54mm)	2	0.400" (10.16mm)	Surface Mount	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-131-00-050000 CONN HDR POST 31POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-131-00-050000 CONN HDR POST 31POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
370-40-139-00-001000 CONN HDR TURRET 39POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	39	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
370-90-139-00-001000 CONN HDR TURRET 39POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	39	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
334-90-115-00-000000 CONN HDR POST 15POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	15	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
334-90-132-00-050000 HEADER SOLDERTAIL SIP 32POS Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Tube	Active	DIP, DIL - Header	Post, Extended	32	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
334-40-132-00-050000 CONN HDR POST 32POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Tube	Active	Header	Post, Extended	32	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-10-108-00-000000 CONN HDR POST 8POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	8	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
850-10-024-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	24	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
342-10-116-00-594000 CONN HDR DIP POST 16POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	16	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
370-10-131-00-001000 CONN HDR TURRET 31POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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