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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
370-40-149-00-001000 CONN HDR TURRET 49POS TIN Mill-Max Manufacturing Corp.	0	-	RFQ	Datenblatt	370	Tube	Active	Header	Turret	49	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
850-10-016-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	3	-	RFQ	Datenblatt	850	Tube	Active	Header	Solder Cup	16	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
AW 122-01/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	1	-	1	-	Through Hole	Solder	-	Gold	Flash	Black
AW 122-02/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	2	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
AW 122-03/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	3	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
AW 122-04/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	4	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
TS-101-T-J .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	0	-	RFQ	Datenblatt	TS	Bulk	Active	Header	Mating Target	1	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
AW 122-05/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	5	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
AR 06-ST/T PIN HEADER Assmann WSW Components	0	-	RFQ	-	-	Bulk	Active	DIP, DIL - Header	Post	6	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	Flash	Black
01-0600-10 CONN HDR DIP FORK 1POS TIN Aries Electronics	0	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Forked	1	-	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
01-0600-20 CONN SIL HDR POST 1POS TIN Aries Electronics	0	-	RFQ	Datenblatt	0600	Bulk	Active	SIP, SIL - Header	Post	1	-	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
AW 122-06/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	6	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
370-80-102-00-001101 CONN HDR STRIP TURRET 2POS TIN Preci-Dip	0	-	RFQ	Datenblatt	370	Bulk	Active	Header Strip	Turret	2	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	-	Black
01-0600-11 CONN HDR DIP FORK 1POS GOLD Aries Electronics	0	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Forked	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
HTS-101-T-J .100" HIGH-TEMP SINGLE ROW SCREW Samtec Inc.	0	-	RFQ	Datenblatt	HTS	Bulk	Active	Header	Mating Target	1	-	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
AW 122-07/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	7	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black
01-0600-21 CONN HDR DIP POST 1POS GOLD Aries Electronics	0	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Post	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
TS-101-T-A-2 .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	0	-	RFQ	Datenblatt	TS	Bulk	Active	Header	Post	1	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
TS-101-T-C .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	0	-	RFQ	Datenblatt	TS	Bulk	Active	Header	Turret	1	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
AW 122-08/G-T PIN HEADER Assmann WSW Components	0	-	RFQ	-	AW 122	Bulk	Active	DIP, DIL - Header	Post	8	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	Flash	Black

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