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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
18-0625-51 CONN HDR STRIP FORK 18POS GOLD Aries Electronics	-	RFQ	Datenblatt	0625	Bulk	Active	Header Strip	Forked	18	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
360-10-155-00-001101 CONN HDR STRIP SLOT 55POS GOLD Preci-Dip	-	RFQ	Datenblatt	360	Bulk	Active	Header Strip	Slotted	55	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-129-00-010000 CONN HDR POST 29POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	29	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-129-00-010000 CONN HDR POST 29POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	29	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
380-10-113-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	13	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
370-40-133-00-001000 CONN HDR TURRET 33POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	33	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
850-40-023-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	23	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
18-6625-51 CONN HDR DIP FORK 18POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	18	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
180-10-314-00-001000 CONN HDR DIP SOLDER 14POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	180	Tube	Active	DIP, DIL - Header	Solder Cup	14	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-136-00-020000 CONN HDR POST 36POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	36	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-136-00-020000 CONN HDR POST 36POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	36	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
800-10-020-10-007000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	800	Tube	Active	Header Strip	Solder Cup	20	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
830-10-013-20-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	830	Bulk	Active	Header	Solder Cup	13	0.079" (2.00mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
38-6625-11 CONN HDR DIP FORK 38POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	38	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
342-90-120-00-593000 HEADER SOLDERTAIL SIP 20POS Mill-Max Manufacturing Corp.	-	RFQ	-	342	Tube	Active	DIP, DIL - Header	Post, Extended	20	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
852-40-036-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Bulk	Active	Header	Solder Cup	36	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
380-40-119-00-001000 CONN HDR SOLDER 19POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	19	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
380-90-119-00-001000 CONN HDR SOLDER 19POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	19	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
142-90-308-00-594000 CONN HDR DIP POST 8POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	142	Tube	Active	DIP, DIL - Header	Post, Extended	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
142-40-308-00-594000 CONN HDR DIP POST 8POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	142	Tube	Active	DIP, DIL - Header	Post, Extended	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black

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