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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Ergebnis

Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
334-90-124-00-050000 CONN HDR POST 24POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	24	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
383-10-137-00-001101 CONN HDR STRIP SOLDER 37POS GOLD Preci-Dip	-	RFQ	Datenblatt	383	Bulk	Active	Header Strip	Solder Cup	37	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
342-10-159-00-591000 CONN HDR DIP POST 59POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	59	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-40-125-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	25	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
64-9625-70 CONN HDR DIP POST 64POS TIN Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Post	64	0.100" (2.54mm)	2	0.900" (22.86mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
151-10-632-00-017101 CONN HDR DIP MALE PIN 32POS GOLD Preci-Dip	-	RFQ	Datenblatt	151	Bulk	Active	DIP, DIL - Header	Post	32	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-147-00-001101 CONN HDR STRIP SOLDER 47POS GOLD Preci-Dip	-	RFQ	Datenblatt	380	Bulk	Active	Header Strip	Solder Cup	47	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-133-00-020000 CONN HDR POST 33POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	33	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
334-90-133-00-020000 CONN HDR POST 33POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	33	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
800-10-015-10-007000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	800	Bulk	Active	Header Strip	Solder Cup	15	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
134-10-322-00-020000 CONN HDR DIP POST 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	22	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
134-10-422-00-020000 CONN HDR DIP POST 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	22	0.100" (2.54mm)	2	0.400" (10.16mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-160-00-001101 CONN HDR STRIP SOLDER 60POS GOLD Preci-Dip	-	RFQ	Datenblatt	380	Bulk	Active	Header Strip	Solder Cup	60	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
480-10-218-00-002000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	480	Tube	Active	Header	Solder Cup	18	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
370-10-124-00-001000 CONN HDR TURRET 24POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	24	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
852-40-014-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Tube	Active	Header	Solder Cup	14	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
170-10-322-00-001000 CONN HDR DIP TURRET 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	170	Tube	Active	DIP, DIL - Header	Turret	22	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
170-10-422-00-001000 CONN HDR DIP TURRET 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	170	Tube	Active	DIP, DIL - Header	Turret	22	0.100" (2.54mm)	2	0.400" (10.16mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-40-126-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	26	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
830-10-012-20-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	830	Bulk	Active	Header	Solder Cup	12	0.079" (2.00mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black

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