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Startseite > Produkte > Steckverbinder, Verbindungselemente > Rechteckige Steckverbinder > Stiftleisten, Spezialstift

Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Hersteller-Teilenr.	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
370-90-131-00-001000 CONN HDR TURRET 31POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	31	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
380-40-123-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	23	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Tin	200.0µin (5.08µm)	Black
370-10-122-00-001000 CONN HDR TURRET 22POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	22	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
334-40-111-00-000000 CONN HDR POST 11POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	11	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
134-10-316-00-010000 CONN HDR DIP POST 16POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
28-8625-31 CONN HDR DIP SOLDER 28POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Solder Cup	28	0.100" (2.54mm)	2	0.800" (20.32mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
380-10-111-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	380	Bulk	Active	Header	Solder Cup	11	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
TS-130-G-E .100" SINGLE ROW SCREW MACHINE T Samtec Inc.	-	RFQ	Datenblatt	TS	Bulk	Active	Header	Post	30	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
850-40-017-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	850	Bulk	Active	Header	Solder Cup	17	0.050" (1.27mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
TD-120-G-C-1 .100" DOUBLE ROW SCREW MACHINE T Samtec Inc.	-	RFQ	Datenblatt	TD	Bulk	Active	Header	Turret	40	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Solder	-	Gold	20.0µin (0.51µm)	Black
852-40-016-10-003000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	852	Tube	Active	Header	Solder Cup	16	0.050" (1.27mm)	2	0.050" (1.27mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
380-40-116-00-001000 CONN HDR SOLDER 16POS TIN Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	16	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
380-90-116-00-001000 CONN HDR SOLDER 16POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	16	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
830-10-011-20-005000 STANDARD PIN HEADER Mill-Max Manufacturing Corp.	-	RFQ	-	830	Bulk	Active	Header	Solder Cup	11	0.079" (2.00mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
34-6625-31 CONN HDR DIP SOLDER 34POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Solder Cup	34	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
17-0625-51 CONN HDR STRIP FORK 17POS GOLD Aries Electronics	-	RFQ	Datenblatt	0625	Bulk	Active	Header Strip	Forked	17	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
28-6625-11 CONN HDR DIP FORK 28POS GOLD Aries Electronics	-	RFQ	Datenblatt	625	Bulk	Active	DIP, DIL - Header	Forked	28	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
383-10-136-00-001101 CONN HDR STRIP SOLDER 36POS GOLD Preci-Dip	-	RFQ	Datenblatt	383	Bulk	Active	Header Strip	Solder Cup	36	0.100" (2.54mm)	1	-	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
483-10-236-00-001101 CONN HDR STRIP SOLDER 36POS GOLD Preci-Dip	-	RFQ	Datenblatt	483	Bulk	Active	Header Strip	Solder Cup	36	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Wire Wrap	-	Gold	10.0µin (0.25µm)	Black
151-10-310-00-005000 CONN HDR DIP POST 10POS GOLD Mill-Max Manufacturing Corp.	-	RFQ	Datenblatt	151	Tube	Active	DIP, DIL - Header	Post, Extended	10	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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