Stiftleisten, Buchsen, Buchsen

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
BLM LG 1 2 Z

BLM LG 1 2 Z

suitable for male header SLM and

Fischer Elektronik

0 -
RFQ
BLM LG 1 2 Z

Datenblatt

BLM LG 1 Bulk Active Header Forked - 2 All 0.050" (1.27mm) 1 - Through Hole Solder - Tin 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) - 0.335" (8.50mm) 0.201" (5.10mm) -40°C ~ 163°C UL94 V-0 Tin - - - 1.5A 125VAC
BLM KG 1 20 G

BLM KG 1 20 G

suitable for male header SLM and

Fischer Elektronik

0 -
RFQ
BLM KG 1 20 G

Datenblatt

BLM KG 1 Bulk Active Header Forked - 20 All 0.050" (1.27mm) 1 - Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
MK LP 18 12 Z

MK LP 18 12 Z

Low profile, less than 2.7/3.1 m

Fischer Elektronik

0 -
RFQ
MK LP 18 12 Z

Datenblatt

MK LP 18 Bulk Active Header Precision - 12 All 0.100" (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm) - 0.050" (1.27mm) 0.091" (2.30mm) -40°C ~ 163°C UL94 V-0 Tin - - - 1.5A 60VDC
BLM LG 2 10 Z

BLM LG 2 10 Z

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0 -
RFQ
BLM LG 2 10 Z

Datenblatt

BLM LG 2 Bulk Active Header Forked - 10 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder - Tin 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) - 0.335" (8.50mm) 0.201" (5.10mm) -40°C ~ 163°C UL94 V-0 Tin - - - 1.5A 125VAC
BLM LG 2 6 G

BLM LG 2 6 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0 -
RFQ
BLM LG 2 6 G

Datenblatt

BLM LG 2 Bulk Active Header Forked - 6 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.201" (5.10mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BLM KG 1 31 G

BLM KG 1 31 G

suitable for male header SLM and

Fischer Elektronik

0 -
RFQ
BLM KG 1 31 G

Datenblatt

BLM KG 1 Bulk Active Header Forked - 31 All 0.050" (1.27mm) 1 - Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BLM KG 1 26 Z

BLM KG 1 26 Z

suitable for male header SLM and

Fischer Elektronik

0 -
RFQ
BLM KG 1 26 Z

Datenblatt

BLM KG 1 Bulk Active Header Forked - 26 All 0.050" (1.27mm) 1 - Through Hole Solder - Tin 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Tin - - - 1.5A 125VAC
BLM KG 2 20 G

BLM KG 2 20 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0 -
RFQ
BLM KG 2 20 G

Datenblatt

BLM KG 2 Bulk Active Header Forked - 20 All 0.050" (1.27mm) 2 0.050" (1.27mm) Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BLM KG 1 3 G

BLM KG 1 3 G

suitable for male header SLM and

Fischer Elektronik

0 -
RFQ
BLM KG 1 3 G

Datenblatt

BLM KG 1 Bulk Active Header Forked - 3 All 0.050" (1.27mm) 1 - Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BLM 2 SMD 26 G

BLM 2 SMD 26 G

pitch 1.27 x 2.54 mm; suitable f

Fischer Elektronik

0 -
RFQ
BLM 2 SMD 26 G

Datenblatt

BLM 2 SMD Bulk Active Header Forked - 26 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) - -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BLM LA 1 30 G

BLM LA 1 30 G

convenable pour barette SLM, une

Fischer Elektronik

0 -
RFQ
BLM LA 1 30 G

Datenblatt

BLM LA 1 Bulk Active Header Forked - 30 All 0.050" (1.27mm) 1 - Through Hole Solder - Gold 7.87µin (0.200µm) - 0.335" (8.50mm) 0.118" (3.00mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 125VAC
BL 3 7 G

BL 3 7 G

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 3 7 G

Datenblatt

BL 3 Bulk Active Header Forked - 7 All 0.100" (2.54mm) 1 - Through Hole Solder - Gold 7.87µin (0.200µm) - 0.315" (8.00mm) 0.138" (3.50mm) -40°C ~ 200°C UL94 V-0 Gold - - - 3A 125VAC
BL 2 24 G

BL 2 24 G

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 2 24 G

Datenblatt

BL 2 Bulk Active Header Forked - 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder - Gold 7.87µin (0.200µm) - 0.315" (8.00mm) 0.130" (3.30mm) -40°C ~ 200°C UL94 V-0 Gold - - - 3A 125VAC
BL 4 8 G

BL 4 8 G

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 4 8 G

Datenblatt

BL 4 Bulk Active Header Forked - 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder - Gold 7.87µin (0.200µm) - 0.315" (8.00mm) 0.138" (3.50mm) -40°C ~ 200°C UL94 V-0 Gold - - - 3A 125VAC
BL 4 8 Z

BL 4 8 Z

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 4 8 Z

Datenblatt

BL 4 Bulk Active Header Forked - 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder - Tin 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) - 0.315" (8.00mm) 0.138" (3.50mm) -40°C ~ 200°C UL94 V-0 Tin - - - 3A 125VAC
BL 3 33 Z

BL 3 33 Z

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 3 33 Z

Datenblatt

BL 3 Bulk Active Header Forked - 33 All 0.100" (2.54mm) 1 - Through Hole Solder - Tin 157.5µin ~ 236.2µin (4.00µm ~ 6.00µm) - 0.315" (8.00mm) 0.138" (3.50mm) -40°C ~ 200°C UL94 V-0 Tin - - - 3A 125VAC
MK 01 5 G

MK 01 5 G

for Multi-Layer, contact spring:

Fischer Elektronik

0 -
RFQ
MK 01 5 G

Datenblatt

MK 01 Bulk Active Header Precision - 5 All 0.100" (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm) - 0.130" (3.30mm) 0.130" (3.30mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 60VDC
BL 2 68 G

BL 2 68 G

Stamped contact spring (fork con

Fischer Elektronik

0 -
RFQ
BL 2 68 G

Datenblatt

BL 2 Bulk Active Header Forked - 68 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder - Gold 7.87µin (0.200µm) - 0.315" (8.00mm) 0.130" (3.30mm) -40°C ~ 200°C UL94 V-0 Gold - - - 3A 125VAC
MK 01 21 Z

MK 01 21 Z

for Multi-Layer, contact spring:

Fischer Elektronik

0 -
RFQ
MK 01 21 Z

Datenblatt

MK 01 Bulk Active Header Precision - 21 All 0.100" (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm) - 0.130" (3.30mm) 0.130" (3.30mm) -40°C ~ 163°C UL94 V-0 Tin - - - 1.5A 60VDC
MK 01 8 G

MK 01 8 G

for Multi-Layer, contact spring:

Fischer Elektronik

0 -
RFQ
MK 01 8 G

Datenblatt

MK 01 Bulk Active Header Precision - 8 All 0.100" (2.54mm) 1 - Through Hole Solder - Gold 10.0µin (0.25µm) - 0.130" (3.30mm) 0.130" (3.30mm) -40°C ~ 163°C UL94 V-0 Gold - - - 1.5A 60VDC
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