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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
SSW-102-01-S-S

SSW-102-01-S-S

CONN RCPT 2POS 0.1 GOLD PCB

Samtec Inc.

2,392 -
RFQ
SSW-102-01-S-S

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - - - 4.7A per Contact -
CES-101-01-G-D

CES-101-01-G-D

CONN RCPT 2POS GOLD PCB

Samtec Inc.

0 -
RFQ
CES-101-01-G-D

Datenblatt

CES Bulk Active Receptacle Female Socket Board to Board 2 All - 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.200" (5.08mm) 0.128" (3.25mm) -55°C ~ 125°C UL94 V-0 Gold - - - - -
CES-101-02-G-D

CES-101-02-G-D

CONN RCPT 2POS GOLD PCB

Samtec Inc.

0 -
RFQ
CES-101-02-G-D

Datenblatt

CES Bulk Active Receptacle Female Socket Board to Board 2 All - 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.200" (5.08mm) 0.223" (5.66mm) -55°C ~ 125°C UL94 V-0 Gold - - - - -
10131935-109ULF

10131935-109ULF

CONN RCPT 9POS 0.079 GOLD SMD

Amphenol ICC (FCI)

0 -
RFQ
10131935-109ULF

Datenblatt

Minitek® 2.00mm Tube Active Receptacle Female Socket Board to Board 9 All 0.079" (2.00mm) 1 - Surface Mount Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.177" (4.50mm) - -55°C ~ 125°C UL94 V-0 Tin - - - 2A 200V
SSM-102-L-SV

SSM-102-L-SV

CONN RCPT 2POS 0.1 GOLD SMD

Samtec Inc.

1,529 -
RFQ
SSM-102-L-SV

Datenblatt

Tiger Claw™ SSM Bulk Active Receptacle, Pass Through Female Socket Board to Board or Cable 2 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.290" (7.37mm) - -55°C ~ 125°C - Tin - - - 5.2A per Contact 405VAC, 572VDC
SSW-106-01-TM-S

SSW-106-01-TM-S

CONN RCPT 6POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
SSW-106-01-TM-S

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
SQT-101-01-F-S-RA

SQT-101-01-F-S-RA

CONN RCPT 1POS GOLD PCB R/A

Samtec Inc.

0 -
RFQ

-

SQT Bulk Active Receptacle Forked Board to Board or Cable 1 All - 1 - Through Hole, Right Angle Solder Push-Pull Gold Flash Black 0.079" (2.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESS-102-TT-05

ESS-102-TT-05

CONN SOCKET 2POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESS-102-TT-05

Datenblatt

ESS Bulk Active Elevated Socket Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.500" (12.70mm) 0.173" (4.40mm) -55°C ~ 125°C UL94 V-0 Tin - - - - -
SSQ-102-02-F-S

SSQ-102-02-F-S

CONN RCPT 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
SSQ-102-02-F-S

Datenblatt

SSQ Bulk Active Receptacle Forked Board to Board or Cable 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335" (8.51mm) 0.194" (4.93mm) -55°C ~ 125°C UL94 V-0 Tin - - - - 465VAC, 655VDC
ESW-101-12-L-S

ESW-101-12-L-S

CONN SOCKET 1POS GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-101-12-L-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 1 All - 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
316-43-102-41-003000

316-43-102-41-003000

CONN SOCKET 2POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

8,756 -
RFQ
316-43-102-41-003000

Datenblatt

316 Bulk Active Elevated Socket Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.315" (8.00mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - - - 3A -
SS-102-T-2

SS-102-T-2

CONN RCPT 2POS 0.1 GOLD PCB

Samtec Inc.

3,959 -
RFQ
SS-102-T-2

Datenblatt

SS Bulk Active Receptacle Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.100" (2.54mm) 0.125" (3.18mm) -55°C ~ 125°C - Tin - - - - -
SSQ-102-01-S-S

SSQ-102-01-S-S

CONN RCPT 2POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
SSQ-102-01-S-S

Datenblatt

SSQ Bulk Active Receptacle Forked Board to Board or Cable 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 125°C UL94 V-0 Tin - - - - 465VAC, 655VDC
SSW-102-01-TM-D

SSW-102-01-TM-D

CONN RCPT 4POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ

-

SSW Bulk Active Receptacle Forked Board to Board or Cable 4 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.104" (2.64mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
SD-103-TT-2

SD-103-TT-2

CONN SKT .100" 6POS

Samtec Inc.

0 -
RFQ

-

SD Bulk Active Receptacle Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black - 0.125" (3.18mm) -55°C ~ 105°C - Tin - - - - -
801-93-002-10-001000

801-93-002-10-001000

CONN RCPT 2POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

14,050 -
RFQ
801-93-002-10-001000

Datenblatt

801 Bulk Active Receptacle Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276" (7.00mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 Tin-Lead - - - 4.5A -
801-43-002-10-001000

801-43-002-10-001000

CONN RCPT 2POS 0.1 GOLD PCB

Mill-Max Manufacturing Corp.

4,765 -
RFQ
801-43-002-10-001000

Datenblatt

801 Bulk Active Receptacle Female Socket Board to Board 2 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.276" (7.00mm) 0.118" (3.00mm) -55°C ~ 125°C UL94 V-0 Tin - - - 4.5A -
91596-308LF

91596-308LF

CONN RCPT 8POS 0.079 GOLD SMD

Amphenol ICC (FCI)

0 -
RFQ
91596-308LF

Datenblatt

Minitek® 2.00mm Tube Active Receptacle, Bottom Entry Female Socket Board to Board or Cable 8 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 15.0µin (0.38µm) Black 0.091" (2.30mm) - -55°C ~ 125°C UL94 V-0 Gold - - - 1A 200V
20021323-00004C1LF

20021323-00004C1LF

CONN RCPT 4POS 0.05 GOLD SMD

Amphenol ICC (FCI)

0 -
RFQ
20021323-00004C1LF

Datenblatt

Minitek127® 1.27mm Tape & Reel (TR) Active Receptacle, Bottom Entry Female Socket Board to Board 4 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold Flash Black 0.087" (2.20mm) - -40°C ~ 105°C UL94 V-0 - - - Pick and Place - -
338068-8

338068-8

CONN RCPT 8POS 0.1 TIN PCB

TE Connectivity AMP Connectors

3,122 -
RFQ
338068-8

Datenblatt

Micro-MaTch Tape & Reel (TR) Active Receptacle Forked Board to Board or Cable 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Friction Lock Tin - Red 0.157" (4.00mm) 0.122" (3.10mm) -40°C ~ 105°C UL94 V-0 Tin - - - - 100VDC
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