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| Foto | Hersteller-Teilenr. | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung | Produktstatus | Anschlusstyp | Kontakttyp | Stil | Anzahl der Positionen | Anzahl der geladenen Positionen | Abstand - Paarung | Anzahl der Reihen | Reihenabstand - Paarung | Montageart | Anschluss | Befestigungstyp | Kontaktoberfläche – Paarung | Kontaktoberflächendicke - Paarung | Isolierungsfarbe | Isolierhöhe | Kontaktlänge - Pfosten | Betriebstemperatur | Entflammbarkeitsklasse des Materials | Kontaktoberfläche - Pfosten | Stapelhöhen bei Steckverbindungen | Schutzart | Funktionen | Stromstärke (Ampere) | Spannungsstärke |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ESW-111-33-L-DCONN SOCKET 22POS 0.1 GOLD PCB |
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Datenblatt |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 22 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.2A per Contact | 550VAC |
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ESQ-116-13-G-S-LLCONN SOCKET 16POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Bulk | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Kinked Pin, Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.435" (11.05mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | Gold | - | - | - | 5.7A per Contact | 550VAC |
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ESQ-111-23-S-SCONN SOCKET 11POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 11 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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ESQ-113-48-S-SCONN SOCKET 13POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 13 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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ESQ-114-23-L-SCONN SOCKET 14POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 14 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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TLE-111-01-G-DV-A-PCONN RCPT 22POS 0.079 GOLD SMD |
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TLE | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board or Cable | 22 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.177" (4.50mm) | - | -55°C ~ 125°C | - | Gold | - | - | Board Guide, Pick and Place | 3.2A per Contact | - |
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ESW-113-33-F-DCONN SOCKET 26POS 0.1 GOLD PCB |
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Datenblatt |
ESW | Bulk | Active | Elevated Socket | Forked | Board to Board | 26 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.2A per Contact | 550VAC |
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ESW-130-23-T-SCONN SOCKET 30POS 0.1 TIN PCB |
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Datenblatt |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 30 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Tin | - | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 105°C | UL94 V-0 | Tin | - | - | - | 5.2A per Contact | 550VAC |
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ESQ-108-69-L-DCONN SOCKET 16POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.735" (18.67mm) | 0.180" (4.57mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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ESW-112-23-S-SCONN SOCKET 12POS 0.1 GOLD PCB |
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Datenblatt |
ESW | Tube | Active | Elevated Socket | Forked | Board to Board | 12 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.535" (13.60mm) | 0.190" (4.83mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.2A per Contact | 550VAC |
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CLP-126-02-L-DCONN RCPT 52POS 0.05 GOLD SMD |
6 | - |
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Datenblatt |
CLP | Bulk | Active | Receptacle | Female Socket | Board to Board | 52 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 3.3A per Contact | 240VAC, 330VDC |
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ESQ-113-33-T-TCONN SOCKET 39POS 0.1 TIN PCB |
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Datenblatt |
ESQ | Bulk | Active | Elevated Socket | Forked | Board to Board | 39 | All | 0.100" (2.54mm) | 3 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Tin | - | Black | 0.635" (16.13mm) | 0.090" (2.29mm) | -55°C ~ 105°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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HLE-104-02-S-DV-BE-A-KCONN RCPT 8POS 0.1 GOLD SMD |
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Datenblatt |
HLE | Tube | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 8 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | Tin | - | - | Board Guide, Pick and Place | 4.1A per Contact | 400VAC |
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SQT-125-01-F-SCONN RCPT 25POS 0.079 GOLD PCB |
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SQT | Tube | Active | Receptacle | Forked | Board to Board or Cable | 25 | All | 0.079" (2.00mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | Flash | Black | 0.250" (6.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.1A per Contact | - |
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HLE-106-02-G-DV-PE-LCCONN RCPT 12POS 0.1 GOLD PCB |
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HLE | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board | 12 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.138" (3.50mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | Gold | - | - | Board Lock | 4.1A per Contact | 400VAC |
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ESQ-116-12-S-SCONN SOCKET 16POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 16 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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HLE-112-02-L-DV-ACONN RCPT 24POS 0.1 GOLD SMD |
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Datenblatt |
HLE | Tube | Active | Receptacle | Female Socket | Board to Board | 24 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | Tin | - | - | Board Guide | 4.1A per Contact | 400VAC |
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HLE-112-02-L-DV-LCCONN RCPT 24POS 0.1 GOLD SMD |
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HLE | Bulk | Active | Receptacle | Female Socket | Board to Board | 24 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.144" (3.66mm) | - | -55°C ~ 125°C | - | Tin | - | - | Board Lock | 4.1A per Contact | 400VAC |
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ESQ-104-12-L-TCONN SOCKET 12POS 0.1 GOLD PCB |
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Datenblatt |
ESQ | Tube | Active | Elevated Socket | Forked | Board to Board | 12 | All | 0.100" (2.54mm) | 3 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.435" (11.05mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | Tin | - | - | - | 5.7A per Contact | 550VAC |
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SSM-113-L-DV-LC-PCONN RCPT 26POS 0.1 GOLD SMD |
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Tiger Claw™ SSM | Tube | Active | Receptacle, Pass Through | Female Socket | Board to Board or Cable | 26 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.290" (7.37mm) | - | -55°C ~ 125°C | - | Tin | - | - | Board Lock, Pick and Place | 5.2A per Contact | 405VAC, 572VDC |
