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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
RSM-107-02-LM-D-P

RSM-107-02-LM-D-P

SURFACE-MOUNT MICRO SOCKET, 0.05

Samtec Inc.

0 -
RFQ
RSM-107-02-LM-D-P

Datenblatt

RSM Tube Active Receptacle Female Socket Board to Board 14 All 0.050" (1.27mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - Pick and Place 3.1A per Contact -
ESQ-104-44-S-D-LL

ESQ-104-44-S-D-LL

CONN SOCKET 8POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-104-44-S-D-LL

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
RSM-116-02-T-S-P

RSM-116-02-T-S-P

CONN RCPT 16POS 0.05 TIN SMD

Samtec Inc.

0 -
RFQ
RSM-116-02-T-S-P

Datenblatt

RSM Tube Active Receptacle Female Socket Board to Board 16 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Tin - Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - Pick and Place 3.1A per Contact -
ESW-107-24-G-D

ESW-107-24-G-D

CONN SOCKET 14POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-107-24-G-D

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-110-59-S-S

ESW-110-59-S-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-110-59-S-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-111-23-T-D

ESW-111-23-T-D

CONN SOCKET 22POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-111-23-T-D

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 22 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-110-12-S-S

ESQ-110-12-S-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-110-12-S-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-116-23-L-S

ESW-116-23-L-S

CONN SOCKET 16POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-116-23-L-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 16 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-125-12-T-S

ESQ-125-12-T-S

CONN SOCKET 25POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-125-12-T-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 25 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-105-34-L-D

ESQ-105-34-L-D

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-34-L-D

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-121-12-T-S

ESW-121-12-T-S

CONN SOCKET 21POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-121-12-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 21 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
RSM-112-02-L-S-P

RSM-112-02-L-S-P

CONN RCPT 12POS 0.05 GOLD SMD

Samtec Inc.

0 -
RFQ
RSM-112-02-L-S-P

Datenblatt

RSM Tube Active Receptacle Female Socket Board to Board 12 All 0.050" (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.240" (6.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - Pick and Place 3.1A per Contact -
833-83-018-10-453101

833-83-018-10-453101

CONN SOCKET 18POS 0.079 GOLD PCB

Preci-Dip

70 -
RFQ
833-83-018-10-453101

Datenblatt

833 Bulk Active Socket Female Socket Board to Board 18 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.315" (8.00mm) 0.126" (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - - - 3A -
ESW-110-69-G-S

ESW-110-69-G-S

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-110-69-G-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.735" (18.67mm) 0.180" (4.57mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-112-24-G-S

ESW-112-24-G-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-112-24-G-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESQ-112-13-L-S

ESQ-112-13-L-S

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-112-13-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESW-117-24-T-S

ESW-117-24-T-S

CONN SOCKET 17POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-117-24-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 17 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-118-33-T-S

ESW-118-33-T-S

CONN SOCKET 18POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-118-33-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 18 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
2-338069-4

2-338069-4

CONN RCPT 24POS 0.1 TIN SMD

TE Connectivity AMP Connectors

34 -
RFQ
2-338069-4

Datenblatt

Micro-MaTch Tape & Reel (TR) Active Receptacle Forked Board to Board or Cable 24 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Friction Lock Tin - Red 0.209" (5.30mm) - -40°C ~ 105°C UL94 V-0 Tin - - - - 100VDC
MMS-120-02-F-DV

MMS-120-02-F-DV

CONN RCPT 40POS 0.079 GOLD SMD

Samtec Inc.

70 -
RFQ
MMS-120-02-F-DV

Datenblatt

MMS Tube Active Receptacle Female Socket Board to Board or Cable 40 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.177" (4.50mm) - -55°C ~ 125°C - Tin - - - 3.9A per Contact -
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