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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
ESW-106-13-G-D-LL-12

ESW-106-13-G-D-LL-12

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-13-G-D-LL-12

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 11 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESQ-108-23-T-S

ESQ-108-23-T-S

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESQ-108-23-T-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SQT-108-01-FM-S

SQT-108-01-FM-S

CONN RCPT 8POS 0.079 GOLD PCB

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 8 All 0.079" (2.00mm) 1 - Through Hole Solder Push-Pull Gold Flash Black 0.250" (6.35mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESW-106-24-L-S

ESW-106-24-L-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-24-L-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-33-G-D-LL

ESW-106-33-G-D-LL

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-33-G-D-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
ESW-106-23-G-D-12

ESW-106-23-G-D-12

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-23-G-D-12

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 11 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
SSA-119-W-T

SSA-119-W-T

CONN RCPT 19POS 0.1 TIN PCB

Samtec Inc.

44 -
RFQ
SSA-119-W-T

Datenblatt

SSA Bulk Active Receptacle, Breakaway Female Socket Board to Board 19 All 0.100" (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Tin - Black 0.230" (5.85mm) 0.656" (16.66mm) -55°C ~ 105°C UL94 V-0 - - - - - 1000V
ESW-105-33-S-D-LL

ESW-105-33-S-D-LL

CONN SOCKET 10POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-33-S-D-LL

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 10 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Kinked Pin, Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-106-38-G-S

ESQ-106-38-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-38-G-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESQ-106-23-S-S

ESQ-106-23-S-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-23-S-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
ESQ-105-33-S-S

ESQ-105-33-S-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-33-S-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SQT-110-01-F-D-RA-017

SQT-110-01-F-D-RA-017

CONN RCPT 20P 0.079 GOLD PCB R/A

Samtec Inc.

0 -
RFQ

-

SQT Tube Active Receptacle Forked Board to Board or Cable 20 19 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole, Right Angle Solder Push-Pull Gold Flash Black 0.157" (4.00mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.1A per Contact -
ESW-105-12-T-D-04

ESW-105-12-T-D-04

CONN SOCKET 10POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-105-12-T-D-04

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 10 9 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-106-33-S-D

ESW-106-33-S-D

CONN SOCKET 12POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-106-33-S-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 12 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-105-34-L-S

ESW-105-34-L-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESW-105-34-L-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.635" (16.13mm) 0.280" (7.11mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-108-24-T-S

ESW-108-24-T-S

CONN SOCKET 8POS 0.1 TIN PCB

Samtec Inc.

0 -
RFQ
ESW-108-24-T-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 8 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.535" (13.60mm) 0.380" (9.65mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESQ-106-12-L-S

ESQ-106-12-L-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-12-L-S

Datenblatt

ESQ Tube Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SSW-126-02-T-S-RA-LL

SSW-126-02-T-S-RA-LL

CONN RCPT 26POS 0.1 TIN PCB R/A

Samtec Inc.

0 -
RFQ

-

SSW Bulk Active Receptacle Forked Board to Board or Cable 26 All 0.100" (2.54mm) 1 - Through Hole, Right Angle Kinked Pin, Solder Push-Pull Tin - Black 0.095" (2.41mm) 0.100" (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
ESQ-105-48-G-S

ESQ-105-48-G-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-105-48-G-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
ESQ-106-33-G-S

ESQ-106-33-G-S

CONN SOCKET 6POS 0.1 GOLD PCB

Samtec Inc.

0 -
RFQ
ESQ-106-33-G-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.7A per Contact 550VAC
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