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Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Stil Anzahl der Positionen Anzahl der geladenen Positionen Abstand - Paarung Anzahl der Reihen Reihenabstand - Paarung Montageart Anschluss Befestigungstyp Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Isolierungsfarbe Isolierhöhe Kontaktlänge - Pfosten Betriebstemperatur Entflammbarkeitsklasse des Materials Kontaktoberfläche - Pfosten Stapelhöhen bei Steckverbindungen Schutzart Funktionen Stromstärke (Ampere) Spannungsstärke
SSW-108-02-F-S-RA

SSW-108-02-F-S-RA

CONN RCPT 8POS 0.1 GOLD PCB R/A

Samtec Inc.

57 -
RFQ
SSW-108-02-F-S-RA

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 8 All 0.100" (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.095" (2.41mm) 0.100" (2.54mm) -55°C ~ 125°C UL94 V-0 Tin - - - 4.7A per Contact -
ESQT-102-03-F-D-309

ESQT-102-03-F-D-309

CONN SOCKET 4POS 0.079 GOLD PCB

Samtec Inc.

87 -
RFQ
ESQT-102-03-F-D-309

Datenblatt

ESQT Bulk Active Elevated Socket Forked Board to Board or Cable 4 All 0.079" (2.00mm) 2 0.079" (2.00mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.309" (7.85mm) 0.149" (3.78mm) -55°C ~ 125°C UL94 V-0 Tin - - - 4.5A per Contact -
ESW-105-23-L-S

ESW-105-23-L-S

CONN SOCKET 5POS 0.1 GOLD PCB

Samtec Inc.

24 -
RFQ
ESW-105-23-L-S

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 5 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.535" (13.60mm) 0.190" (4.83mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
ESW-102-13-L-D

ESW-102-13-L-D

CONN SOCKET 4POS 0.1 GOLD PCB

Samtec Inc.

30 -
RFQ
ESW-102-13-L-D

Datenblatt

ESW Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 125°C UL94 V-0 Tin - - - 5.2A per Contact 550VAC
SLM-103-01-G-D

SLM-103-01-G-D

CONN RCPT 6POS 0.05 GOLD PCB

Samtec Inc.

74 -
RFQ
SLM-103-01-G-D

Datenblatt

SLM Bulk Active Receptacle Forked Board to Board 6 All 0.050" (1.27mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.180" (4.57mm) 0.115" (2.92mm) -55°C ~ 125°C - Gold - - - - -
SSW-107-02-T-D

SSW-107-02-T-D

CONN RCPT .100" 14POS DUAL TIN

Samtec Inc.

36 -
RFQ
SSW-107-02-T-D

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 14 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Tin - Black 0.335" (8.51mm) 0.194" (4.93mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
ESW-107-12-G-S

ESW-107-12-G-S

CONN SOCKET 7POS 0.1 GOLD PCB

Samtec Inc.

62 -
RFQ
ESW-107-12-G-S

Datenblatt

ESW Tube Active Elevated Socket Forked Board to Board 7 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 20.0µin (0.51µm) Black 0.435" (11.05mm) 0.090" (2.29mm) -55°C ~ 125°C UL94 V-0 Gold - - - 5.2A per Contact 550VAC
929974-01-03-RK

929974-01-03-RK

3M BOARDMOUNT SOCKET, 929 SERIES

3M

81 -
RFQ
929974-01-03-RK

Datenblatt

929 Bulk Active Receptacle Forked Board to Board 3 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin 100.0µin (2.54µm) Black 0.325" (8.25mm) 0.125" (3.18mm) -40°C ~ 105°C UL94 V-0 Tin - - - 2A 1500V
BCS-103-F-D-PE

BCS-103-F-D-PE

CONN RCPT 6POS 0.1 GOLD PCB

Samtec Inc.

46 -
RFQ
BCS-103-F-D-PE

Datenblatt

Tiger Claw™ BCS Bulk Active Receptacle, Pass Through Female Socket Board to Board 6 All 0.100" (2.54mm) 2 0.100" (2.54mm) Through Hole Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.290" (7.37mm) 0.128" (3.25mm) -55°C ~ 125°C UL94 V-0 Tin - - - 4.6A per Contact 475VAC
SSW-102-22-F-D-VS

SSW-102-22-F-D-VS

CONN RCPT 4POS 0.1 GOLD SMD

Samtec Inc.

83 -
RFQ
SSW-102-22-F-D-VS

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 4 All 0.100" (2.54mm) 2 0.100" (2.54mm) Surface Mount Solder Push-Pull Gold 3.00µin (0.076µm) Black 0.335" (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - - - 4.7A per Contact -
SSW-106-22-L-S-VS

SSW-106-22-L-S-VS

CONN RCPT 6POS 0.1 GOLD SMD

Samtec Inc.

75 -
RFQ
SSW-106-22-L-S-VS

Datenblatt

SSW Tube Active Receptacle Forked Board to Board or Cable 6 All 0.100" (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.335" (8.51mm) - -55°C ~ 125°C UL94 V-0 Tin - - - 4.7A per Contact -
DF11CZ-20DS-2V(22)

DF11CZ-20DS-2V(22)

CONN RCPT 20POS 0.079 TIN SMD

Hirose Electric Co Ltd

1,063 -
RFQ
DF11CZ-20DS-2V(22)

Datenblatt

DF11 Tape & Reel (TR) Active Receptacle Female Socket Board to Board or Cable 20 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Friction Lock Tin 39.4µin (1.00µm) Beige 0.234" (5.95mm) - -30°C ~ 85°C UL94 V-0 Tin 7.55mm, 8.2mm - Pick and Place, Solder Retention 2A 250V
801-83-007-20-101101

801-83-007-20-101101

CONN SOCKET 4P 0.2 GOLD PCB R/A

Preci-Dip

96 -
RFQ
801-83-007-20-101101

Datenblatt

801 Bulk Active Socket Female Socket Board to Board 4 All 0.200" (5.08mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100" (2.54mm) 0.126" (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - - - 3A -
SL-104-T-19

SL-104-T-19

CONN RCPT 4POS 0.1 GOLD PCB

Samtec Inc.

99 -
RFQ
SL-104-T-19

Datenblatt

SL Bulk Active Receptacle Female Socket Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.083" (2.10mm) 0.082" (2.08mm) -55°C ~ 125°C - - - - - - -
CLT-104-02-L-D

CLT-104-02-L-D

CONN RCPT 8POS DUAL 2MM SMD

Samtec Inc.

55 -
RFQ
CLT-104-02-L-D

Datenblatt

CLT Tube Active Receptacle Female Socket Board to Board 8 All 0.079" (2.00mm) 2 0.079" (2.00mm) Surface Mount Solder Push-Pull Gold 10.0µin (0.25µm) Black 0.083" (2.10mm) - -55°C ~ 125°C UL94 V-0 Tin - - - 4.1A per Contact -
SSW-112-02-T-S-RA

SSW-112-02-T-S-RA

CONN RCPT 12POS 0.1 TIN PCB R/A

Samtec Inc.

50 -
RFQ
SSW-112-02-T-S-RA

Datenblatt

SSW Bulk Active Receptacle Forked Board to Board or Cable 12 All 0.100" (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Tin - Black 0.095" (2.41mm) 0.100" (2.54mm) -55°C ~ 105°C UL94 V-0 Tin - - - 4.7A per Contact -
1374879

1374879

CONN RECEPTACLE 1.27MM 32POS SMD

Phoenix Contact

73 -
RFQ
1374879

Datenblatt

- Tape & Reel (TR) Active Receptacle Female Socket Board to Board 32 All 0.050" (1.27mm) 2 0.050" (1.27mm) Surface Mount Solder Push-Pull Gold - Black 0.356" (9.05mm) - -55°C ~ 125°C UL94 V-0 Tin - - Board Guide, Solder Retention 2.1A -
ESQ-106-13-T-S

ESQ-106-13-T-S

CONN SOCKET 6POS 0.1 TIN PCB

Samtec Inc.

25 -
RFQ
ESQ-106-13-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 6 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.435" (11.05mm) 0.290" (7.37mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
SL-104-G-10

SL-104-G-10

CONN RCPT .100" 4POS GOLD PCB

Samtec Inc.

91 -
RFQ
SL-104-G-10

Datenblatt

SL Bulk Active Receptacle Female Socket Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Gold 30.0µin (0.76µm) Black 0.122" (3.10mm) 0.108" (2.75mm) -55°C ~ 125°C - Gold - - - - -
ESQ-104-33-T-S

ESQ-104-33-T-S

CONN SOCKET 4POS 0.1 TIN PCB

Samtec Inc.

17 -
RFQ
ESQ-104-33-T-S

Datenblatt

ESQ Bulk Active Elevated Socket Forked Board to Board 4 All 0.100" (2.54mm) 1 - Through Hole Solder Push-Pull Tin - Black 0.635" (16.13mm) 0.090" (2.29mm) -55°C ~ 105°C UL94 V-0 Tin - - - 5.7A per Contact 550VAC
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