Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
FTS-113-01-L-DV-TR

FTS-113-01-L-DV-TR

CONN HEADER SMD 26POS 1.27MM

Samtec Inc.

860 -
RFQ
FTS-113-01-L-DV-TR

Datenblatt

FTS Tape & Reel (TR) Active Header, Cuttable Male Pin 0.050" (1.27mm) 26 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.120" (3.05mm) - - 0.034" (0.86mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 3.4A per Contact
T1M-16-F-SV-L

T1M-16-F-SV-L

DISCRETE WIRE TERMINAL STRIP, 1.

Samtec Inc.

797 -
RFQ
T1M-16-F-SV-L

Datenblatt

Micro Mate™ T1M Tape & Reel (TR) Active Header Male Pin 0.039" (1.00mm) 16 1 - All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.217" (5.51mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 85°C 3.3A per Contact
IL-AG5-30P-D3T2

IL-AG5-30P-D3T2

Interconnect Rectangular

JAE Electronics

198 -
RFQ
IL-AG5-30P-D3T2

Datenblatt

IL-AG5 Bulk Active Header Male Pin 0.098" (2.50mm) 30 2 0.118" (3.00mm) All Board to Board Shrouded - 4 Wall Through Hole Solder Latch Holder 0.331" (8.40mm) 0.138" (3.50mm) 0.598" (15.20mm) 0.717" (18.20mm) Square Tin - Tin Brass Polybutylene Terephthalate (PBT) Board Guide -40°C ~ 85°C 3A
PS-10PF-D4T1-PKL1

PS-10PF-D4T1-PKL1

CONN HEADER VERT 10POS 2.54MM

JAE Electronics

180 -
RFQ

-

PS Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Cable/Wire Unshrouded Through Hole Solder Push-Pull 0.177" (4.50mm) - - - Square Gold - - - - - - -
PS-10PE-D4LT1-PN1

PS-10PE-D4LT1-PN1

CONN HEADER R/A 10POS 2.54MM

JAE Electronics

172 -
RFQ
PS-10PE-D4LT1-PN1

Datenblatt

PS Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Cable/Wire Unshrouded Through Hole, Right Angle Solder Push-Pull 0.236" (6.00mm) 0.110" (2.79mm) - 0.260" (6.60mm) Square Gold 3.90µin (0.099µm) - Copper Alloy Polybutylene Terephthalate (PBT) - - -
1-178315-3

1-178315-3

CONN HEADER VERT 5POS 3.81MM

TE Connectivity AMP Connectors

5,578 -
RFQ
1-178315-3

Datenblatt

Dynamic D-3100 Bulk Active Header Tab 0.150" (3.81mm) 5 1 - All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Detent Lock - 0.150" (3.81mm) - 0.850" (21.59mm) Rectangular Gold or PdNi +Gold 30.0µin (0.76µm) Tin Copper Alloy Thermoplastic, Polyester, Glass Filled Board Lock -55°C ~ 105°C -
2MM-HSP-D07-HT-02-H-TB

2MM-HSP-D07-HT-02-H-TB

14P, AMPMODU 2 MM, SHROUDED HEAD

TE Connectivity AMP Connectors

1,556 -
RFQ
2MM-HSP-D07-HT-02-H-TB

Datenblatt

AMPMODU 2MM Tube Active Header Male Pin 0.079" (2.00mm) 14 2 0.079" (2.00mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole, Right Angle Solder Latch Holder 0.157" (4.00mm) 0.110" (2.79mm) - 0.244" (6.20mm) Square Gold 30.0µin (0.76µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -40°C ~ 125°C 2A
2MM-HSP-S14-HT-02-H-TB

2MM-HSP-S14-HT-02-H-TB

14P, AMPMODU 2 MM, SHROUDED HEAD

TE Connectivity AMP Connectors

1,134 -
RFQ
2MM-HSP-S14-HT-02-H-TB

Datenblatt

AMPMODU 2MM Tube Active Header Male Pin 0.079" (2.00mm) 14 1 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole, Right Angle Solder Latch Holder 0.157" (4.00mm) 0.110" (2.79mm) - 0.244" (6.20mm) Square Gold 30.0µin (0.76µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -40°C ~ 125°C 2A
0349580342

0349580342

CONN HEADER VERT 34POS

Molex

684 -
RFQ
0349580342

Datenblatt

Mini50 34958 Tray Active Header Male Blade - 34 3 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Latch Lock - - - 0.697" (17.70mm) Rectangular Tin - Tin Copper Alloy Syndiotactic Polystyrene (SPS), Glass Filled Board Guide - -
TFM-103-02-L-D-WT-K-TR

TFM-103-02-L-D-WT-K-TR

CONN HEADER SMD 6POS 1.27MM

Samtec Inc.

683 -
RFQ
TFM-103-02-L-D-WT-K-TR

Datenblatt

Tiger Eye™ TFM Tape & Reel (TR) Active Header Male Pin 0.050" (1.27mm) 6 2 0.050" (1.27mm) All Board to Board or Cable Shrouded - 4 Wall Surface Mount Solder Push-Pull 0.131" (3.33mm) - - 0.220" (5.60mm) Square Gold 15.0µin (0.38µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) Pick and Place, Solder Retention -55°C ~ 125°C 3.2A per Contact
854-10-012-10-001101

854-10-012-10-001101

CONN HEADER VERT 12POS 1.27MM

Preci-Dip

320 -
RFQ
854-10-012-10-001101

Datenblatt

854 Bulk Active Header Male Pin 0.050" (1.27mm) 12 3 0.050" (1.27mm) All Board to Board Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.075" (1.90mm) Circular Gold 10.0µin (0.25µm) Gold Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - -55°C ~ 125°C 1A
HIF3BAF-20PA-2.54DSA(63)

HIF3BAF-20PA-2.54DSA(63)

CONN HEADER VERT 20POS 2.54MM

Hirose Electric Co Ltd

128 -
RFQ
HIF3BAF-20PA-2.54DSA(63)

Datenblatt

HIF3B Tray Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Latch Lock/Eject Hooks - 0.130" (3.30mm) - 0.701" (17.80mm) Square Gold 8.00µin (0.203µm) Tin Brass Polybutylene Terephthalate (PBT) Keying Slot -55°C ~ 85°C Varies by Wire Gauge
1600641103

1600641103

HSAL2 ASSY 6 CKT VERT HDR UNSLD

Molex

496 -
RFQ
1600641103

Datenblatt

- Tape & Reel (TR) Active Header Male Pin 0.050" (1.27mm) 6 2 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder - - - - - Rectangular Gold 16.0µin (0.41µm) Tin Copper Alloy Syndiotactic Polystyrene (SPS), Glass Filled Board Guide, Solder Retention -40°C ~ 105°C 1.5A per Contact
SHF-104-01-L-D-SM-TR

SHF-104-01-L-D-SM-TR

CONN HEADER SMD 8POS 1.27MM

Samtec Inc.

1,769 -
RFQ
SHF-104-01-L-D-SM-TR

Datenblatt

SHF Tape & Reel (TR) Active Header Male Pin 0.050" (1.27mm) 8 2 0.050" (1.27mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Push-Pull 0.120" (3.05mm) - - 0.210" (5.33mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) Keying Slot -55°C ~ 125°C 3A
MX34008PF1

MX34008PF1

Interconnect Rectangular

JAE Electronics

438 -
RFQ

-

MX34 Bulk Active Header Male Pin 0.087" (2.20mm) 8 1 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Locking Ramp 0.303" (7.70mm) 0.126" (3.20mm) - - Square Tin - Tin Brass Syndiotactic Polystyrene (SPS), Glass Filled - -40°C ~ 85°C 3A
1337146

1337146

CONN HEADER 1.27MM 100POS SMD

Phoenix Contact

543 -
RFQ
1337146

Datenblatt

- Tape & Reel (TR) Active Header Male Pin 0.050" (1.27mm) 100 2 0.050" (1.27mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Push-Pull - - - 0.325" (8.25mm) Square Gold - Gold Copper Alloy Liquid Crystal Polymer (LCP) Board Guide, Solder Retention -55°C ~ 125°C 2.2A
IPT1-105-08-L-D

IPT1-105-08-L-D

CONN HEADER VERT 10POS 2.54MM

Samtec Inc.

114 -
RFQ
IPT1-105-08-L-D

Datenblatt

Mini Mate® IPT1 Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Board Shrouded - 4 Wall Through Hole Solder Push-Pull 0.155" (3.94mm) 0.094" (2.40mm) 1.090" (27.69mm) 0.996" (25.29mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 2.3A per Contact
2394521-2

2394521-2

1.5P RIGHT ANGLE DUAL-ROW LOCKIN

TE Connectivity Linx

2,398 -
RFQ
2394521-2

Datenblatt

High Performance Interconnect (HPI) Tape & Reel (TR) Active Header Male Pin 0.059" (1.50mm) 20 2 0.185" (4.70mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount, Right Angle Solder Locking Ramp - - - 0.362" (9.20mm) Square Tin 100.0µin (2.54µm) Tin Copper Alloy Thermoplastic - -40°C ~ 105°C Varies by Wire Gauge
5-1375583-3

5-1375583-3

CONN HEADER SMD 4POS 2.54MM

TE Connectivity AMP Connectors

1,037 -
RFQ
5-1375583-3

Datenblatt

AMPMODU MTE Tape & Reel (TR) Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Shrouded - 4 Wall Surface Mount Solder Latch Holder 0.230" (5.84mm) - - 0.535" (13.60mm) Square Gold 30.0µin (0.76µm) Tin Brass Thermoplastic Board Lock, Keying Slot -65°C ~ 105°C 3A
M80-8530845

M80-8530845

CONN HEADER VERT 8POS 2MM

Harwin Inc.

903 -
RFQ
M80-8530845

Datenblatt

Datamate L-Tek Bulk Active Header Male Pin 0.079" (2.00mm) 8 2 0.079" (2.00mm) All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Latch Lock - 0.118" (3.00mm) - 0.219" (5.56mm) Circular Gold 29.5µin (0.75µm) - Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled - -55°C ~ 125°C 2.2A per Contact
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