Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
1-2394520-3

1-2394520-3

1.5P VERTICAL DUAL-ROW LOCKING H

TE Connectivity Linx

3,600 -
RFQ
1-2394520-3

Datenblatt

High Performance Interconnect (HPI) Tape & Reel (TR) Active Header Male Pin 0.059" (1.50mm) 30 2 0.185" (4.70mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.205" (5.20mm) Square Gold Flash Gold Copper Alloy Thermoplastic Solder Retention -40°C ~ 105°C Varies by Wire Gauge
1-2834499-2

1-2834499-2

MINI DYNAMIC HDR H 12P TIN Y-KEY

TE Connectivity AMP Connectors

1,000 -
RFQ
1-2834499-2

Datenblatt

Mini Dynamic Tape & Reel (TR) Active Header, Elevated Male Pin 0.071" (1.80mm) 12 2 - All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Push-Pull - - - 0.341" (8.65mm) Square Tin - Tin Copper Alloy Thermoplastic Solder Retention - -
TMM-110-06-G-D-SM-A

TMM-110-06-G-D-SM-A

2MM TERMINAL STRIP

Samtec Inc.

246 -
RFQ
TMM-110-06-G-D-SM-A

Datenblatt

TMM Tube Active Header Male Pin 0.079" (2.00mm) 20 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.168" (4.27mm) - - 0.059" (1.50mm) Square Gold 20.0µin (0.51µm) Gold Phosphor Bronze Liquid Crystal Polymer (LCP) Board Guide -55°C ~ 125°C 3.2A per Contact
4-2394520-4

4-2394520-4

1.5P VERTICAL DUAL-ROW LOCKING H

TE Connectivity Linx

3,000 -
RFQ
4-2394520-4

Datenblatt

High Performance Interconnect (HPI) Tape & Reel (TR) Active Header Male Pin 0.059" (1.50mm) 40 2 0.185" (4.70mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.205" (5.20mm) Square Tin 100.0µin (2.54µm) Tin Copper Alloy Thermoplastic - -40°C ~ 105°C Varies by Wire Gauge
4-2394521-2

4-2394521-2

1.5P RIGHT ANGLE DUAL-ROW LOCKIN

TE Connectivity Linx

2,400 -
RFQ
4-2394521-2

Datenblatt

High Performance Interconnect (HPI) Tape & Reel (TR) Active Header Male Pin 0.059" (1.50mm) 20 2 0.185" (4.70mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount, Right Angle Solder Locking Ramp - - - 0.362" (9.20mm) Square Tin 100.0µin (2.54µm) Tin Copper Alloy Thermoplastic - -40°C ~ 105°C Varies by Wire Gauge
3-178141-5

3-178141-5

CONN HEADER VERT 6POS 3.81MM

TE Connectivity AMP Connectors

1,600 -
RFQ
3-178141-5

Datenblatt

Dynamic D-3100 Bulk Active Header Tab 0.150" (3.81mm) 6 2 0.300" (7.62mm) All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Detent Lock - 0.150" (3.81mm) - 0.850" (21.59mm) Rectangular Tin 78.7µin (2.00µm) Tin Copper Alloy Thermoplastic, Polyester, Glass Filled Board Lock -55°C ~ 105°C -
TMM-113-01-L-D-RA

TMM-113-01-L-D-RA

2MM TERMINAL STRIP

Samtec Inc.

6 -
RFQ
TMM-113-01-L-D-RA

Datenblatt

TMM Bulk Active Header Male Pin 0.079" (2.00mm) 26 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.126" (3.20mm) 0.120" (3.05mm) - 0.155" (3.94mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 3.2A per Contact
1-825440-0

1-825440-0

CONN HEADER VERT 20POS 2.54MM

TE Connectivity AMP Connectors

4,744 -
RFQ
1-825440-0

Datenblatt

AMPMODU Mod II Bulk Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.264" (6.70mm) 0.126" (3.20mm) 0.500" (12.70mm) 0.110" (2.79mm) Square Gold 3.90µin (0.099µm) Tin Brass Polybutylene Terephthalate (PBT) - -65°C ~ 105°C -
2MM-HSP-D09-VT-02-H-TB

2MM-HSP-D09-VT-02-H-TB

18P, AMPMODU 2 MM, SHROUDED HEAD

TE Connectivity AMP Connectors

2,261 -
RFQ
2MM-HSP-D09-VT-02-H-TB

Datenblatt

AMPMODU 2MM Tube Active Header Male Pin 0.079" (2.00mm) 18 2 0.079" (2.00mm) All Board to Board or Cable Shrouded - 2 Wall Through Hole Solder Latch Holder 0.157" (4.00mm) 0.110" (2.80mm) 0.327" (8.30mm) 0.217" (5.51mm) Square Gold 30.0µin (0.76µm) Tin Phosphor Bronze Thermoplastic Polarizing Key -40°C ~ 105°C 2A
TST-102-01-G-D

TST-102-01-G-D

CONN HEADER VERT 4POS 2.54MM

Samtec Inc.

166 -
RFQ
TST-102-01-G-D

Datenblatt

Flex Stack, TST Bulk Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Push-Pull 0.250" (6.35mm) 0.115" (2.92mm) 0.480" (12.19mm) 0.350" (8.89mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled Keying Slot -55°C ~ 125°C 3.4A per Contact
TSW-116-08-T-T-RA

TSW-116-08-T-T-RA

CONN HDR .100" 48POS

Samtec Inc.

18 -
RFQ
TSW-116-08-T-T-RA

Datenblatt

TSW Bulk Active Header Male Pin 0.100" (2.54mm) 48 3 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Tin - Tin Phosphor Bronze Polybutylene Terephthalate (PBT) - -55°C ~ 105°C -
IPL1-102-02-F-D-K

IPL1-102-02-F-D-K

CONN HEADER SMD 4POS 2.54MM

Samtec Inc.

154 -
RFQ
IPL1-102-02-F-D-K

Datenblatt

Mini Mate® IPL1 Tube Active Header Male Pin 0.100" (2.54mm) 4 2 0.100" (2.54mm) All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp 0.215" (5.46mm) - - 0.320" (8.13mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C -
FTSH-110-01-F-DH-C

FTSH-110-01-F-DH-C

CONN HEADER SMD R/A 20POS 1.27MM

Samtec Inc.

101 -
RFQ
FTSH-110-01-F-DH-C

Datenblatt

FTSH Tube Active Header, Cuttable Male Pin 0.050" (1.27mm) 20 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Surface Mount, Right Angle Solder Push-Pull 0.120" (3.05mm) - - 0.135" (3.43mm) Square Gold 3.00µin (0.076µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) Pick and Place -55°C ~ 125°C 3.4A per Contact
1-316132-3

1-316132-3

CONN HEADER VERT 5POS 5.08MM

TE Connectivity AMP Connectors

6,128 -
RFQ
1-316132-3

Datenblatt

Dynamic D-3200 Bulk Active Header Tab 0.200" (5.08mm) 5 1 - All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Detent Lock - 0.150" (3.81mm) - 0.850" (21.59mm) Rectangular Gold or PdNi +Gold 30.0µin (0.76µm) Tin Copper Alloy Thermoplastic, Polyester, Glass Filled Board Lock -55°C ~ 105°C -
1-179277-3

1-179277-3

CONN HEADER R/A 4POS 5.08MM

TE Connectivity AMP Connectors

5,435 -
RFQ
1-179277-3

Datenblatt

Dynamic D-3200 Bulk Active Header Tab 0.200" (5.08mm) 4 1 - All Board to Board or Cable Shrouded - 4 Wall Through Hole, Right Angle Solder Detent Lock - 0.150" (3.81mm) - 0.368" (9.35mm) Rectangular Gold or PdNi +Gold 30.0µin (0.76µm) Tin Copper Alloy Thermoplastic, Polyester, Glass Filled Board Lock -55°C ~ 105°C -
172260-1

172260-1

CONN HEADER VERT 8POS 3MM

TE Connectivity AMP Connectors

2,395 -
RFQ
172260-1

Datenblatt

DLI (Dual Line Interlock) Tray Active - Male Pin 0.118" (3.00mm) 8 2 0.181" (4.60mm) All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Locking Ramp 0.335" (8.51mm) 0.157" (4.00mm) 0.618" (15.70mm) 0.736" (18.69mm) Rectangular Tin - Tin Copper Alloy Polyamide (PA66), Nylon 6/6 Mounting Brackets -30°C ~ 105°C 5A
TFM-107-02-STL-D-WT

TFM-107-02-STL-D-WT

HIGH-RELIABILITY TIGER EYE TERMI

Samtec Inc.

110 -
RFQ
TFM-107-02-STL-D-WT

Datenblatt

Tiger Eye™ TFM Tube Active Header Male Pin 0.050" (1.27mm) 14 2 0.050" (1.27mm) All Board to Board or Cable Shrouded - 4 Wall Surface Mount Solder Push-Pull 0.131" (3.33mm) - - 0.220" (5.60mm) Square Gold 30.0µin (0.76µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) Solder Retention -55°C ~ 125°C 3.2A per Contact
N3793-2302RB

N3793-2302RB

CONN HEADER VERT 10POS 2.54MM

3M

895 -
RFQ
N3793-2302RB

Datenblatt

3000 Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Board or Cable Shrouded - 3 Wall Through Hole Solder Latch Lock/Eject Hooks, Long 0.240" (6.10mm) 0.112" (2.84mm) 0.652" (16.56mm) 0.680" (17.27mm) Square Gold 30.0µin (0.76µm) Tin Copper Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Keying Slot, Mounting Flange -55°C ~ 105°C 1.75A
0348250241

0348250241

CONN HEADER VERT 24POS 2MM

Molex

707 -
RFQ
0348250241

Datenblatt

Mini50 34825 Tray Active Header Male Pin 0.079" (2.00mm) 24 2 - All Board to Cable/Wire Shrouded - 4 Wall Through Hole Solder Latch Holder 0.218" (5.55mm) 0.113" (2.87mm) - 0.614" (15.60mm) Square Tin - Tin Brass Syndiotactic Polystyrene (SPS), Glass Filled Board Guide, Solder Retention - -
N3408-6003RB

N3408-6003RB

CONN HEADER VERT 16POS 2.54MM

3M

602 -
RFQ
N3408-6003RB

Datenblatt

3000 Bulk Active Header Male Pin 0.100" (2.54mm) 16 2 0.100" (2.54mm) All Board to Board or Cable Shrouded - 4 Wall Through Hole Solder Push-Pull 0.240" (6.10mm) 0.155" (3.94mm) 0.695" (17.65mm) 0.680" (17.27mm) Square Gold 30.0µin (0.76µm) Tin Copper Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Keying Slot, Mounting Flange -55°C ~ 105°C 1.75A
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