Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
SLV W 4 KA 036 54 G

SLV W 4 KA 036 54 G

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0 -
RFQ
SLV W 4 KA 036 54 G

Datenblatt

SLV W 4 KA 036 Bulk Active Header Male Pin 0.050" (1.27mm) 54 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SL 5 223 12 G

SL 5 223 12 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 223 12 G

Datenblatt

SL 5 223 Bulk Active Header Male Pin 0.100" (2.54mm) 12 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.244" (31.60mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 285 16 Z

SL 6 285 16 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 285 16 Z

Datenblatt

SL 6 285 Bulk Active Header Male Pin 0.100" (2.54mm) 16 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.488" (37.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 4 KA 036 56 G

SLV W 4 KA 036 56 G

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0 -
RFQ
SLV W 4 KA 036 56 G

Datenblatt

SLV W 4 KA 036 Bulk Active Header Male Pin 0.050" (1.27mm) 56 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SL 5 285 31 G

SL 5 285 31 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 285 31 G

Datenblatt

SL 5 285 Bulk Active Header Male Pin 0.100" (2.54mm) 31 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.488" (37.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 285 20 G

SL 6 285 20 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 285 20 G

Datenblatt

SL 6 285 Bulk Active Header Male Pin 0.100" (2.54mm) 20 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.488" (37.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 4 KA 036 56 Z

SLV W 4 KA 036 56 Z

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0 -
RFQ
SLV W 4 KA 036 56 Z

Datenblatt

SLV W 4 KA 036 Bulk Active Header Male Pin 0.050" (1.27mm) 56 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SL 5 121 4 Z

SL 5 121 4 Z

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 121 4 Z

Datenblatt

SL 5 121 Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 121 54 Z

SL 6 121 54 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 121 54 Z

Datenblatt

SL 6 121 - Active Header Male Pin 0.100" (2.54mm) 54 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 1 098 18 G

SLY 1 098 18 G

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 098 18 G

Datenblatt

SLY 1 098 Tube Active Header Male Pin 0.079" (2.00mm) 18 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.209" (5.30mm) 0.118" (3.00mm) 0.386" (9.80mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 360 10 G

SL 6 360 10 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 360 10 G

Datenblatt

SL 6 360 Bulk Active Header Male Pin 0.100" (2.54mm) 10 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.783" (45.30mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 5 156 26 G

SL 5 156 26 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 156 26 G

Datenblatt

SL 5 156 Bulk Active Header Male Pin 0.100" (2.54mm) 26 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.980" (24.90mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 1 098 17 G

SLY 1 098 17 G

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 098 17 G

Datenblatt

SLY 1 098 Bulk Active Header Male Pin 0.079" (2.00mm) 17 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.209" (5.30mm) 0.118" (3.00mm) 0.386" (9.80mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 121 26 S

SL 6 121 26 S

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 121 26 S

Datenblatt

SL 6 121 - Active Header Male Pin 0.100" (2.54mm) 26 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 10 SMD 040 10 Z

SLY 10 SMD 040 10 Z

0.5 MM

Fischer Elektronik

0 -
RFQ
SLY 10 SMD 040 10 Z

Datenblatt

SLY 10 SMD 040 Bulk Active Header Male Pin 0.079" (2.00mm) 10 2 0.079" (2.00mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.268" (6.80mm) - 0.059" (1.50mm) Circular Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 5 156 1 Z

SL 5 156 1 Z

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 156 1 Z

Datenblatt

SL 5 156 Bulk Active Header Male Pin 0.100" (2.54mm) 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.980" (24.90mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 237 50 S

SL 6 237 50 S

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 237 50 S

Datenblatt

SL 6 237 Tube Active Header Male Pin 0.100" (2.54mm) 50 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.299" (33.00mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 1 085 31 S

SLY 1 085 31 S

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 085 31 S

Datenblatt

SLY 1 085 Bulk Active Header Male Pin 0.079" (2.00mm) 31 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.157" (4.00mm) 0.118" (3.00mm) 0.335" (8.50mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 5 121 26 G

SL 5 121 26 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 121 26 G

Datenblatt

SL 5 121 Bulk Active Header Male Pin 0.100" (2.54mm) 26 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL LP 1 112 11 G

SL LP 1 112 11 G

LOW PROFILE, STRAIGHT, 0.635 M

Fischer Elektronik

0 -
RFQ
SL LP 1 112 11 G

Datenblatt

SL LP 1 112 Bulk Active Header Male Pin 0.100" (2.54mm) 11 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.256" (6.50mm) 0.118" (3.00mm) 0.441" (11.20mm) 0.055" (1.40mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Low Profile -40°C ~ 163°C 3A
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