Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

Alles zurücksetzen
Alle anwenden
Ergebnis
Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
SLV W 8 092 64 Z

SLV W 8 092 64 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 64 Z

Datenblatt

SLV W 8 092 Tube Active Header Male Pin 0.050" (1.27mm) 64 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL LP 6 SMD 066 26 G SM

SL LP 6 SMD 066 26 G SM

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 26 G SM

Datenblatt

SL LP 6 SMD 066 - Active Header Male Pin 0.100" (2.54mm) 26 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 1 104 23 Z

SLY 1 104 23 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 104 23 Z

Datenblatt

SLY 1 104 Bulk Active Header Male Pin 0.079" (2.00mm) 23 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.232" (5.90mm) 0.118" (3.00mm) 0.409" (10.40mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 9 SMD 040 33 Z B SM

SLY 9 SMD 040 33 Z B SM

0.5 MM

Fischer Elektronik

0 -
RFQ
SLY 9 SMD 040 33 Z B SM

Datenblatt

SLY 9 SMD 040 Tube Active Header Male Pin 0.079" (2.00mm) 33 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.157" (4.00mm) 0.130" (3.30mm) 0.346" (8.80mm) 0.059" (1.50mm) Circular Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 172 32 Z

SL 6 172 32 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 172 32 Z

Datenblatt

SL 6 172 Bulk Active Header Male Pin 0.100" (2.54mm) 32 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.043" (26.50mm) 0.110" (2.80mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL LP 6 SMD 066 22 G B TR

SL LP 6 SMD 066 22 G B TR

0.635 MM, LOW PROFILE IN SMD-T

Fischer Elektronik

0 -
RFQ
SL LP 6 SMD 066 22 G B TR

Datenblatt

SL LP 6 SMD 066 Tape & Reel (TR) Active Header Male Pin 0.100" (2.54mm) 22 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.260" (6.60mm) - - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 525 30 Z

SL 6 525 30 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 525 30 Z

Datenblatt

SL 6 525 Bulk Active Header Male Pin 0.100" (2.54mm) 30 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.421" (61.50mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 7 117 4 G

SLV W 7 117 4 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 4 G

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 4 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 285 62 G

SL 6 285 62 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 285 62 G

Datenblatt

SL 6 285 Bulk Active Header Male Pin 0.100" (2.54mm) 62 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.488" (37.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 7 117 10 Z

SLV W 7 117 10 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 10 Z

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 10 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 223 24 S

SL 6 223 24 S

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 223 24 S

Datenblatt

SL 6 223 Bulk Active Header Male Pin 0.100" (2.54mm) 24 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.244" (31.60mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 1 081 38 S

SLY 1 081 38 S

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 081 38 S

Datenblatt

SLY 1 081 Bulk Active Header Male Pin 0.079" (2.00mm) 38 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 1 139 47 Z

SLY 1 139 47 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 139 47 Z

Datenblatt

SLY 1 139 Bulk Active Header Male Pin 0.079" (2.00mm) 47 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.370" (9.40mm) 0.118" (3.00mm) 0.547" (13.90mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 092 30 G

SLV W 7 092 30 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 30 G

Datenblatt

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 30 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 5 525 34 G

SL 5 525 34 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 525 34 G

Datenblatt

SL 5 525 Bulk Active Header Male Pin 0.100" (2.54mm) 34 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.421" (61.50mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 6 117 3 G

SLV W 6 117 3 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0 -
RFQ
SLV W 6 117 3 G

Datenblatt

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 3 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 081 49 Z

SLY 1 081 49 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 081 49 Z

Datenblatt

SLY 1 081 Bulk Active Header Male Pin 0.079" (2.00mm) 49 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 8 092 60 Z

SLV W 8 092 60 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 60 Z

Datenblatt

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 60 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 315 12 Z

SL 6 315 12 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 315 12 Z

Datenblatt

SL 6 315 Bulk Active Header Male Pin 0.100" (2.54mm) 12 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 1.606" (40.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 7 117 24 Z

SLV W 7 117 24 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 24 Z

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 24 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
TomatoElec

Suche

TomatoElec

Produkte

TomatoElec

Telefon

TomatoElec

Benutzer