Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
SL 3 152 1 G

SL 3 152 1 G

MALE HEADER 0.635 MM, DIMENSIO

Fischer Elektronik

0 -
RFQ
SL 3 152 1 G

Datenblatt

SL 3 152 - Active Header Male Pin 0.100" (2.54mm) 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.228" (5.80mm) 0.598" (15.20mm) - 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 7 092 28 G

SLV W 7 092 28 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 28 G

Datenblatt

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 28 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 10 G

SLV W 8 117 10 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 10 G

Datenblatt

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 10 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 117 50 Z

SLV W 7 117 50 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 117 50 Z

Datenblatt

SLV W 7 117 Bulk Active Header Male Pin 0.050" (1.27mm) 50 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 147 58 Z

SL 6 147 58 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 147 58 Z

Datenblatt

SL 6 147 Bulk Active Header Male Pin 0.100" (2.54mm) 58 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.945" (24.00mm) 0.110" (2.80mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 147 62 G

SL 6 147 62 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 147 62 G

Datenblatt

SL 6 147 Bulk Active Header Male Pin 0.100" (2.54mm) 62 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.945" (24.00mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 8 092 24 G

SLV W 8 092 24 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 092 24 G

Datenblatt

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 24 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 6 121 70 Z

SL 6 121 70 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 121 70 Z

Datenblatt

SL 6 121 Bulk Active Header Male Pin 0.100" (2.54mm) 70 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.845" (21.40mm) 0.110" (2.80mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 5 415 4 G

SL 5 415 4 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 415 4 G

Datenblatt

SL 5 415 Bulk Active Header Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 415 30 G

SL 6 415 30 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 415 30 G

Datenblatt

SL 6 415 Bulk Active Header Male Pin 0.100" (2.54mm) 30 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SL 6 147 66 G

SL 6 147 66 G

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 147 66 G

Datenblatt

SL 6 147 Bulk Active Header Male Pin 0.100" (2.54mm) 66 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 0.945" (24.00mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 1 139 35 Z

SLY 1 139 35 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0 -
RFQ
SLY 1 139 35 Z

Datenblatt

SLY 1 139 Bulk Active Header Male Pin 0.079" (2.00mm) 35 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.370" (9.40mm) 0.118" (3.00mm) 0.547" (13.90mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SL 6 415 2 Z

SL 6 415 2 Z

0.635 MM"S" SE

Fischer Elektronik

0 -
RFQ
SL 6 415 2 Z

Datenblatt

SL 6 415 Bulk Active Header Male Pin 0.100" (2.54mm) 2 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 7 092 66 G

SLV W 7 092 66 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 66 G

Datenblatt

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 66 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 48 G

SLV W 8 117 48 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 48 G

Datenblatt

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 40 G

SLV W 7 092 40 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 7 092 40 G

Datenblatt

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 40 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 5 415 32 Z

SL 5 415 32 Z

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 415 32 Z

Datenblatt

SL 5 415 Bulk Active Header Male Pin 0.100" (2.54mm) 32 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.000" (50.80mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLV W 8 117 32 G

SLV W 8 117 32 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0 -
RFQ
SLV W 8 117 32 G

Datenblatt

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SL 5 525 12 G

SL 5 525 12 G

ONE ROW, 0.635 MM

Fischer Elektronik

0 -
RFQ
SL 5 525 12 G

Datenblatt

SL 5 525 Tube Active Header Male Pin 0.100" (2.54mm) 12 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.130" (3.30mm) 2.421" (61.50mm) 0.110" (2.80mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 3A
SLY 11 SMD 092 33 G

SLY 11 SMD 092 33 G

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

0 -
RFQ
SLY 11 SMD 092 33 G

Datenblatt

SLY 11 SMD 092 Bulk Active Header Male Pin 0.079" (2.00mm) 33 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
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