Stiftleisten, Stiftkontakte

Hersteller Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)

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Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung Produktstatus Anschlusstyp Kontakttyp Abstand - Paarung Anzahl der Positionen Anzahl der Reihen Reihenabstand - Paarung Anzahl der geladenen Positionen Stil Ummantelung Montageart Anschluss Befestigungstyp Kontaktlänge - Paarung Kontaktlänge - Pfosten Gesamtkontaktlänge Isolierhöhe Kontaktform Kontaktoberfläche – Paarung Kontaktoberflächendicke - Paarung Kontaktoberfläche - Pfosten Kontaktmaterial Isoliermaterial Funktionen Betriebstemperatur Stromstärke (Ampere)
MTLW-101-09-G-S-422

MTLW-101-09-G-S-422

CONN HEADER THROUGH HOLE 1POS

Samtec Inc.

0 -
RFQ

-

Flex Stack, MTLW Bulk Active Header Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.422" (10.72mm) 0.248" (6.30mm) 0.730" (18.54mm) 0.060" (1.52mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 5.2A per Contact
MTLW-101-09-G-S-435

MTLW-101-09-G-S-435

CONN HEADER THROUGH HOLE 1POS

Samtec Inc.

0 -
RFQ
MTLW-101-09-G-S-435

Datenblatt

Flex Stack, MTLW Bulk Active Header Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.435" (11.05mm) 0.235" (5.97mm) 0.730" (18.54mm) 0.060" (1.52mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 5.2A per Contact
MTLW-101-09-G-S-580

MTLW-101-09-G-S-580

CONN HEADER THROUGH HOLE 1POS

Samtec Inc.

0 -
RFQ
MTLW-101-09-G-S-580

Datenblatt

Flex Stack, MTLW Bulk Active Header Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.580" (14.73mm) 0.090" (2.29mm) 0.730" (18.54mm) 0.060" (1.52mm) Square Gold 10.0µin (0.25µm) Gold Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 5.2A per Contact
0901310121

0901310121

CONN HEADER VERT 2POS

Molex

1,881 -
RFQ
0901310121

Datenblatt

C-Grid III 90131 Bulk Active Header, Breakaway Male Pin - 2 2 0.100" (2.54mm) All Board to Cable/Wire Unshrouded Through Hole Solder Push-Pull 0.266" (6.75mm) 0.114" (2.90mm) 0.478" (12.15mm) 0.098" (2.50mm) Square Tin 118.1µin (3.00µm) Tin Brass Polyester, Glass Filled - - -
MTMM-101-13-L-S-198

MTMM-101-13-L-S-198

CONN HEADER VERT 1POS

Samtec Inc.

0 -
RFQ

-

MTMM Bulk Active Header, Cuttable Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.198" (5.03mm) 0.416" (10.57mm) 0.673" (17.09mm) 0.059" (1.50mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 3A
MTMM-101-14-L-S-190

MTMM-101-14-L-S-190

CONN HEADER VERT 1POS

Samtec Inc.

0 -
RFQ

-

MTMM Bulk Active Header, Cuttable Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.190" (4.83mm) 0.502" (12.76mm) 0.751" (19.08mm) 0.059" (1.50mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 3A
MTMM-101-13-L-S-535

MTMM-101-13-L-S-535

VARIABLE POST HEIGHT HEADER STRI

Samtec Inc.

0 -
RFQ
MTMM-101-13-L-S-535

Datenblatt

MTMM Bulk Active Header, Cuttable Male Pin - 1 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.535" (13.59mm) 0.079" (2.00mm) 0.673" (17.09mm) 0.059" (1.50mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Liquid Crystal Polymer (LCP) - -55°C ~ 125°C 3A
0022288040

0022288040

CONN HEADER R/A 4POS 2.54MM

Molex

1,847 -
RFQ
0022288040

Datenblatt

KK254, 42377 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.244" (6.20mm) 0.120" (3.05mm) - 0.098" (2.50mm) Square Tin 100.0µin (2.54µm) Tin - Polyamide (PA), Nylon, Glass Filled - - -
MTSW-101-06-L-D-060

MTSW-101-06-L-D-060

CONN HEADER VERT 2POS

Samtec Inc.

0 -
RFQ
MTSW-101-06-L-D-060

Datenblatt

Flex Stack, MTSW Bulk Active Header, Cuttable Male Pin - 2 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.060" (1.52mm) 0.140" (3.56mm) 0.300" (7.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Polyester, Glass Filled - -55°C ~ 125°C 3A
MTSW-101-22-L-D-440

MTSW-101-22-L-D-440

CONN HEADER VERT 2POS

Samtec Inc.

0 -
RFQ
MTSW-101-22-L-D-440

Datenblatt

Flex Stack, MTSW Bulk Active Header, Cuttable Male Pin - 2 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.440" (11.17mm) 0.090" (2.29mm) 0.630" (16.00mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Phosphor Bronze Polyester, Glass Filled - -55°C ~ 125°C 3A
0901310127

0901310127

CONN HEADER VERT 14POS 2.54MM

Molex

1,798 -
RFQ
0901310127

Datenblatt

C-Grid III 90131 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 14 2 0.100" (2.54mm) All Board to Cable/Wire Unshrouded Through Hole Solder Push-Pull 0.266" (6.75mm) 0.114" (2.90mm) 0.478" (12.15mm) 0.098" (2.50mm) Square Tin 118.1µin (3.00µm) Tin Brass Polyester, Glass Filled - - -
SYA10-05WV-ET

SYA10-05WV-ET

1 MM W TO B CONNECTOR 5P HEADER

JAM

1,790 -
RFQ
SYA10-05WV-ET

Datenblatt

SYA Cut Tape (CT) Active Header Male Pin 0.039" (1.00mm) 5 1 - All Board to Cable/Wire Shrouded - 4 Wall Surface Mount Solder Locking Ramp - - - 0.213" (5.40mm) Square Tin - Tin Brass Polyamide (PA6T), Nylon 6T, Glass Filled - -40°C ~ 85°C 1A
0026481040

0026481040

CONN HEADER VERT 4POS 3.96MM

Molex

1,710 -
RFQ
0026481040

Datenblatt

KK396, 41661 Bulk Active Header, Breakaway Male Pin 0.156" (3.96mm) 4 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.590" (14.99mm) 0.172" (4.37mm) 0.890" (22.61mm) 0.128" (3.25mm) Square Tin 60.0µin (1.52µm) Tin Brass Polyester, Glass Filled - - -
0010897082

0010897082

CONN HEADER VERT 8POS 2.54MM

Molex

1,701 -
RFQ
0010897082

Datenblatt

C-Grid 70280 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 8 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled - - -
0022284064

0022284064

CONN HEADER VERT 6POS 2.54MM

Molex

1,699 -
RFQ
0022284064

Datenblatt

KK254, 42375 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 6 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.320" (8.13mm) 0.120" (3.05mm) 0.530" (13.46mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin - Polyamide (PA), Nylon, Glass Filled - - -
0901220127

0901220127

CONN HEADER R/A 14POS 2.54MM

Molex

1,657 -
RFQ
0901220127

Datenblatt

C-Grid III 90122 Tray Active Header, Breakaway Male Pin 0.100" (2.54mm) 14 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.266" (6.75mm) 0.114" (2.90mm) - 0.242" (6.14mm) Square Tin 157.5µin (4.00µm) Tin Brass Polyester, Glass Filled - - -
0026481022

0026481022

CONN HEADER R/A 2POS 3.96MM

Molex

1,651 -
RFQ
0026481022

Datenblatt

KK396, 41662 Bulk Active Header, Breakaway Male Pin 0.156" (3.96mm) 2 1 - All Board to Board or Cable Unshrouded Through Hole, Right Angle Solder Push-Pull 0.573" (14.55mm) 0.184" (4.67mm) - 0.128" (3.25mm) Square Tin 60.0µin (1.52µm) Tin Brass Polyester, Glass Filled - - -
0010897142

0010897142

CONN HEADER VERT 14POS 2.54MM

Molex

1,633 -
RFQ
0010897142

Datenblatt

C-Grid 70280 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 14 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.107" (2.71mm) 0.437" (11.10mm) 0.090" (2.29mm) Square Gold 15.0µin (0.38µm) Tin Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled - - -
0901310124

0901310124

CONN HEADER VERT 8POS 2.54MM

Molex

1,618 -
RFQ
0901310124

Datenblatt

C-Grid III 90131 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 8 2 0.100" (2.54mm) All Board to Cable/Wire Unshrouded Through Hole Solder Push-Pull 0.266" (6.75mm) 0.114" (2.90mm) 0.478" (12.15mm) 0.098" (2.50mm) Square Tin 118.1µin (3.00µm) Tin Brass Polyester, Glass Filled - - -
0022284160

0022284160

CONN HEADER VERT 16POS 2.54MM

Molex

1,616 -
RFQ
0022284160

Datenblatt

KK254, 42375 Bulk Active Header, Breakaway Male Pin 0.100" (2.54mm) 16 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.240" (6.10mm) 0.125" (3.18mm) 0.455" (11.56mm) 0.090" (2.29mm) Square Tin 100.0µin (2.54µm) Tin - Polyamide (PA), Nylon, Glass Filled - - -
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