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0755-82798135Energiemanagement – Spezialisiert
Power Management - Spezialisiert
Spezialisierte Power-Management-ICs sind für dedizierte Funktionen wie Leistungssteuerung, Sequenzierung, Überwachung, Schutz und Wandlung ausgelegt, die nicht immer in Standardregler- oder Controller-Kategorien passen. Sie werden häufig in Industrieanlagen, Automobilelektronik, Kommunikationssystemen, Servern, Verbrauchergeräten, Medizintechnik und eingebetteten Anwendungen mit anwendungsspezifischen Stromversorgungslösungen eingesetzt.
TomatoElec ist ein unabhängiger Distributor für elektronische Komponenten und liefert spezialisierte Power-Management-ICs von führenden Herstellern wie Texas Instruments, Analog Devices, STMicroelectronics, onsemi, Infineon, Microchip, Renesas, NXP, Diodes Incorporated und Maxim Integrated. Kunden können in der untenstehenden Produktliste inventory, price, package, specifications, parameters and PDF datasheets prüfen und eine BOM oder RFQ für die Beschaffung spezialisierter Power-Management-ICs einreichen.
| Foto | Hersteller-Teilenr. | Verfügbarkeit | Preis | Menge | Datenblatt | Serie | Verpackung/Gehäuse | Verpackung | Produktstatus | Anwendungen | Strom - Versorgung | Spannung - Versorgung | Betriebstemperatur | Klasse | Qualifizierung | Montageart | Lieferant Gerätepaket |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
UCD9240RGCRIC DGTL PWM SYSTEM CTRLR 64VQFN |
0 | - |
|
Datenblatt |
Fusion Digital Power™ | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Special Purpose | - | 3V ~ 3.6V | -40°C ~ 110°C | - | - | Surface Mount | 64-VQFN (9x9) |
|
TWL6032A2B6YFFTIC PWR/BATT MGMT 155DSBGA |
0 | - |
|
Datenblatt |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Discontinued at Digi-Key | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
|
MC35FS6512CAER2FS6500 |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS4501CAEFS4500 |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS6501CAEFS6500 |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC34PF8100FJEPPOWER MANAGEMENT IC, I.MX8, PRE- |
0 | - |
|
Datenblatt |
- | 56-VFQFN Exposed Pad | Tray | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
LT8253AHUFDM#TRPBF40V USB TYPE-C PD 60W 4-SW BUCK- |
0 | - |
|
Datenblatt |
- | 28-WFQFN Exposed Pad | Tape & Reel (TR) | Active | USB, Type-C Controller | 2.1mA | 4V ~ 40V | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 28-QFN (4x5) |
|
MC35FS6508CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC34FS6407NAER2SYSTEM BASIS CHIP CAN 5V 0.7 |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-HLQFP (7x7) |
|
TPS65073RSLRIC PWR MGMT 5CH W/2 LDO 48VQFN |
0 | - |
|
Datenblatt |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Mobile/OMAP™ | - | 2.8V ~ 6.3V | -40°C ~ 85°C | - | - | Surface Mount | 48-VQFN (6x6) |
|
MC35FS6503NAER2FS6500 |
0 | - |
|
Datenblatt |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
