Energiemanagement – ​​Spezialisiert

Hersteller Serie Verpackung/Gehäuse Verpackung Produktstatus Anwendungen Strom - Versorgung Spannung - Versorgung Betriebstemperatur Klasse Qualifizierung Montageart Lieferant Gerätepaket

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Power Management - Spezialisiert

Spezialisierte Power-Management-ICs sind für dedizierte Funktionen wie Leistungssteuerung, Sequenzierung, Überwachung, Schutz und Wandlung ausgelegt, die nicht immer in Standardregler- oder Controller-Kategorien passen. Sie werden häufig in Industrieanlagen, Automobilelektronik, Kommunikationssystemen, Servern, Verbrauchergeräten, Medizintechnik und eingebetteten Anwendungen mit anwendungsspezifischen Stromversorgungslösungen eingesetzt.

TomatoElec ist ein unabhängiger Distributor für elektronische Komponenten und liefert spezialisierte Power-Management-ICs von führenden Herstellern wie Texas Instruments, Analog Devices, STMicroelectronics, onsemi, Infineon, Microchip, Renesas, NXP, Diodes Incorporated und Maxim Integrated. Kunden können in der untenstehenden Produktliste inventory, price, package, specifications, parameters and PDF datasheets prüfen und eine BOM oder RFQ für die Beschaffung spezialisierter Power-Management-ICs einreichen.

Foto Hersteller-Teilenr. Verfügbarkeit Preis Menge Datenblatt Serie Verpackung/Gehäuse Verpackung Produktstatus Anwendungen Strom - Versorgung Spannung - Versorgung Betriebstemperatur Klasse Qualifizierung Montageart Lieferant Gerätepaket
MC33PF8200EMESR2

MC33PF8200EMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200EMESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ETESR2

MC33PF8200ETESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200ETESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200A0ESR2

MC33PF8200A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200A0ESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DNESR2

MC33PF8200DNESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200DNESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DMESR2

MC33PF8200DMESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200DMESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DFESR2

MC33PF8200DFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200DFESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200DHESR2

MC33PF8200DHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200DHESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200ESESR2

MC33PF8200ESESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200ESESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8200CXESR2

MC33PF8200CXESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
RFQ
MC33PF8200CXESR2

Datenblatt

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
UCD9240RGCR

UCD9240RGCR

IC DGTL PWM SYSTEM CTRLR 64VQFN

Texas Instruments

0 -
RFQ
UCD9240RGCR

Datenblatt

Fusion Digital Power™ 64-VFQFN Exposed Pad Tape & Reel (TR) Active Special Purpose - 3V ~ 3.6V -40°C ~ 110°C - - Surface Mount 64-VQFN (9x9)
TWL6032A2B6YFFT

TWL6032A2B6YFFT

IC PWR/BATT MGMT 155DSBGA

Texas Instruments

0 -
RFQ
TWL6032A2B6YFFT

Datenblatt

- 155-UFBGA, DSBGA Tape & Reel (TR) Discontinued at Digi-Key Handheld/Mobile Devices, OMAP™ 20µA 2.5V ~ 4.8V -40°C ~ 85°C - - Surface Mount 155-DSBGA (5.21x5.36)
MC35FS6512CAER2

MC35FS6512CAER2

FS6500

NXP USA Inc.

0 -
RFQ
MC35FS6512CAER2

Datenblatt

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501CAE

MC35FS4501CAE

FS4500

NXP USA Inc.

0 -
RFQ
MC35FS4501CAE

Datenblatt

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501CAE

MC35FS6501CAE

FS6500

NXP USA Inc.

0 -
RFQ
MC35FS6501CAE

Datenblatt

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34PF8100FJEP

MC34PF8100FJEP

POWER MANAGEMENT IC, I.MX8, PRE-

NXP USA Inc.

0 -
RFQ
MC34PF8100FJEP

Datenblatt

- 56-VFQFN Exposed Pad Tray Active Processor 10µA 2.5V ~ 5.5V -40°C ~ 105°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
LT8253AHUFDM#TRPBF

LT8253AHUFDM#TRPBF

40V USB TYPE-C PD 60W 4-SW BUCK-

Analog Devices Inc.

0 -
RFQ
LT8253AHUFDM#TRPBF

Datenblatt

- 28-WFQFN Exposed Pad Tape & Reel (TR) Active USB, Type-C Controller 2.1mA 4V ~ 40V -40°C ~ 150°C (TJ) - - Surface Mount, Wettable Flank 28-QFN (4x5)
MC35FS6508CAER2

MC35FS6508CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
RFQ
MC35FS6508CAER2

Datenblatt

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC34FS6407NAER2

MC34FS6407NAER2

SYSTEM BASIS CHIP CAN 5V 0.7

NXP USA Inc.

0 -
RFQ
MC34FS6407NAER2

Datenblatt

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C (TA) - - Surface Mount 48-HLQFP (7x7)
TPS65073RSLR

TPS65073RSLR

IC PWR MGMT 5CH W/2 LDO 48VQFN

Texas Instruments

0 -
RFQ
TPS65073RSLR

Datenblatt

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Mobile/OMAP™ - 2.8V ~ 6.3V -40°C ~ 85°C - - Surface Mount 48-VQFN (6x6)
MC35FS6503NAER2

MC35FS6503NAER2

FS6500

NXP USA Inc.

0 -
RFQ
MC35FS6503NAER2

Datenblatt

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
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